Fast seamless joining of SiC_w/Ti₃SiC₂ composite using electric field‐assisted sintering technique

Abstract

A pair of Ti3SiC2 reinforced with SiC whiskers (SiCw/Ti3SiC2) composites was successfully joined without any joining materials using electric field‐assisted sintering technology at a temperature as low as 1090°C (Ti) and a short time of 30 s. The microstructure and mechanical properties of the obtained SiCw/Ti3SiC2 joints were investigated. The solid‐state diffusion was the main joining mechanism, which was facilitated by a relatively high current density (~586 A/cm2) at the joining interface. The shear strength of the sample joined at 1090°C was 51.8 ± 2.9 MPa. The sample joined at 1090°C failed in the matrix rather than at the interface, which confirmed that a sound inter‐diffusion bonding was obtained. A rapid and high efficient self‐joining process may find application in the case of SiCw/Ti3SiC2 sealing cladding tube and end cap.