Fast Root Cause Analysis Based on Electrical Defect Localization

Abstract

The ability to rapidly perform root cause analysis (RCA) on yield limiting defects is critical to a fab’s ramp. Here we present two methodologies for RCA using specially designed high density test structure arrays and a FIB/SEM DualBeam. These methodologies have been proven to identify the root cause of both hard and soft electrical failures. Correlation between electrical test results and the yield-impacting defects are presented.