Fast Methodology for Determining Eye Diagram Characteristics of Lossy Transmission Lines

Guo, Wei-Da; Lin, Jeng-Hau; Lin, Chin‐Wen; Huang, Tian-Wei; Wu, Ruey-Beei

doi:10.1109/tadvp.2008.2006276

Cited by 41 publications

(11 citation statements)

References 15 publications

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“…where B is a time derived from transmission line telegrapher's equation [7]. The IQP has a sharp rise at the beginning which is consistent with the impulse response of microelectronic packages.…”

Section: Problem Formulationsupporting

confidence: 69%

Impulse response generation from S-parameters for power delivery network simulation

Kang

Wang

Lin

et al. 2015

2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity

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Accurate analysis of power delivery network is indispensable to assess VLSI package and interconnection network. Given the S-parameters that characterize the linear packaging system, we derive the transient response of power delivery networks. We utilize the compressed sensing technique to generate the impulse response that fits the S-parameters with sparsity. Our method shows accurate, concise, and stable results.

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Section: Problem Formulationsupporting

confidence: 69%

Impulse response generation from S-parameters for power delivery network simulation

Kang

Wang

Lin

et al. 2015

2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity

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“…Eye diagram [4] is a measurement method for evaluating the transmission quality through either a device or a system in a statistical way, especially, considering the dispersion effect [5] due to operation in the wide range of frequency. Unfortunately, eye diagram measurement is not easy to carry for modern digital interconnections, due to that such a kind of interconnections are not accessible for measurement equipments.…”

Section: Introductionmentioning

confidence: 99%

A Hybrid De-Embedding Technique of Eye Diagram Measurement for High-Speed Digital Interconnections

Huang

Chao

2014

IEEE Trans. Compon., Packag. Manufact. Technol.

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By a modeling technique of equivalent lumped circuit for high-speed interconnections, an innovative method is proposed to predict the physical intrinsic eye diagram. Such a technique is based on the measured impedance profile results of time-domain reflectometry, which includes the electric characteristics both of the connector itself and testing jigs. The latter's are to be removed to leave the connector's part only for the eye diagram prediction. This method can be verified further by SPICE simulation and measurement in this paper.Index Terms-Equivalent lumped circuit, eye diagram, high-speed interconnections, SPICE model, time-domain reflectometry (TDR).

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“…Even backplane connector also plays a critical role to meet radiated emission limits [8]. In addition, the dispersion resulted from the frequency-dependent losses would also aggravate the signal distortion even further for the sharper rise times associated with the faster data rates [9].…”

Section: Introductionmentioning

confidence: 99%

SI-Aware Vias and Contact Pads Layouts and L--R Equalization Technique for 12 Gb/s Backplane Serial I/O Interconnections

Yao

Chang²,

Liu³

et al. 2013

IEEE Trans. Electromagn. Compat.

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With increasing demand on higher performance for high-speed blade servers, the signal integrity aware (SI-aware) layouts and equalization have been attributed as the critical techniques to improve the electrical performance. This paper describes the SI-aware layouts of patterned ground and capsule-shaped antipad to enhance the connector performance. Besides, a new differential equalizer by taking advantage of differential via-stubs is proposed to restore the deteriorated eye diagram. Their application of a 117.5-cm SATA-II links demonstrates significant improvement in eye height and timing jitter. Furthermore, a viable approach is suggested to successfully reopen the eyes when the data rate increases from the current 3 to 12 Gb/s. The measurement results are also provided to validate the proposed design concepts.Index Terms-Antipad, backplane, blade server, contact pads, equalizer, eye diagram, intersymbol interference, through-hole via, via stub.

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Fast Methodology for Determining Eye Diagram Characteristics of Lossy Transmission Lines

Cited by 41 publications

References 15 publications

Impulse response generation from S-parameters for power delivery network simulation

Impulse response generation from S-parameters for power delivery network simulation

A Hybrid De-Embedding Technique of Eye Diagram Measurement for High-Speed Digital Interconnections

SI-Aware Vias and Contact Pads Layouts and L--R Equalization Technique for 12 Gb/s Backplane Serial I/O Interconnections

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