2012
DOI: 10.1063/1.4737644
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Fast electrothermally activated micro-positioner using a high-aspect-ratio micro-machined polymeric composite

Abstract: Recently, silicon electrothermal micro-actuators have been developed for dual-stage micropositioning in hard disk drive. But, silicon with a low coefficient of thermal expansion (CTE) has a shortcoming of requiring a large temperature change (>300 °C) to expand adequately. This letter presented a high-CTE polymer composite to solve the shortcoming of silicon. The polymer composite consists of high-aspect-ratio micro-machined SU-8 thermal expander and silicon thermal conductor. A micro-positioner which e… Show more

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Cited by 10 publications
(11 citation statements)
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“…The material properties used in the present models are summarized in Table I, which are based on the data available in the literatures. 22,23,25,26 Due to the small size of the microheater, in our analysis, the heat conduction through the substrate dominated the micro-heater heat loss while the heat convection and heat radiation losses can be negligible. 26 Simulation results showed that a stroke of about 4.573 lm can be obtained when 6 V driving voltage was applied to the microheater of the PTAA unit, as shown in Fig.…”
mentioning
confidence: 89%
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“…The material properties used in the present models are summarized in Table I, which are based on the data available in the literatures. 22,23,25,26 Due to the small size of the microheater, in our analysis, the heat conduction through the substrate dominated the micro-heater heat loss while the heat convection and heat radiation losses can be negligible. 26 Simulation results showed that a stroke of about 4.573 lm can be obtained when 6 V driving voltage was applied to the microheater of the PTAA unit, as shown in Fig.…”
mentioning
confidence: 89%
“…Also, SU-8 has a high coefficient of thermal expansion (CTE 150 Â 10 À6 /K, almost 60 times larger than that of silicon, 2.6 Â 10 À6 /K), which is very suitable to be used as a thermal expansion material. [22][23][24] Hence, an out-of-plane micro-force function generator (MFFG) is fabricated based on polymeric thermal actuators array (PTAA), which is capable of producing large displacement at low driving voltage (CMOS comparative voltage). Also, special microdeformation of MEMS substrate can be modified or realized by this out-of-plane MFFG.…”
mentioning
confidence: 99%
“…2 Simulated displacements and frequencies varying with the beam width design with 20μm beam width is an improved design that can result in an actuation stroke larger than 100nm and a mechanical resonance frequency above 30 kHz. This new micro-actuator design with a slender side beam (w b =20μm) was fabricated using the reported fabrication process (Lau et al 2012. Figure 4 shows the optical micrographs of a silicon die carrying the thermal micro-actuator.…”
Section: Design Considerationmentioning
confidence: 99%
“…For these steps, the process simplicity and flexibility are determined by the selection of the sacrificial layers. The processing flow depicted in Figure 1 can be used for non-photosensitive polymeric sacrificial layers, metallic sacrificial layers or silicic ones [2,[13][14][15][16][17]. Other photoresist types can be used as sacrificial layers [6,8,18,19].…”
Section: Introductionmentioning
confidence: 99%