Fast-cure liquid encapsulant for ICs

Abstract

A new fast-cure liquid encapsulant family has been developed .These materials can be cured for less 10 minutes at 150 C and have the characteristics that are equivalent to the purity of the conventional liquid encapsulant for I n .Also , these materials are one-component type and the viscosity increase is approximetly 20% after 48 hours at 25 C allowing flexible pot life.