Fast correlations of pre-silicon integrated chip-package-board DDR4-2133 memory channel simulations with silicon measurements via active signal probing - a case study

Chan, Koay Soon; Teng, Wei Khoon

doi:10.1109/apemc.2016.7522740

2016 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC) 2016

DOI: 10.1109/apemc.2016.7522740

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Fast correlations of pre-silicon integrated chip-package-board DDR4-2133 memory channel simulations with silicon measurements via active signal probing - a case study

Koay Soon Chan¹,

Wei Khoon Teng²

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Fast correlations of pre-silicon integrated chip-package-board DDR4-2133 memory channel simulations with silicon measurements via active signal probing - a case study

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