Fast and efficient method to detect probe mark and wire bond induced pad damage

Tan, Jethro; Chan, Gary; Kho, W. F.

doi:10.1109/ipfa.2016.7564272

Cited by 4 publications

(1 citation statement)

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“…Yeoh et al (2013) indicated that a large and deep probe mark triggered intermetallic deterioration and bond degradation. Therefore, larger probe marks are likely to induce pad cracks during the bonding process (Tan et al, 2016).…”

Section: Introductionmentioning

confidence: 99%

Multi-response optimization of IC wire bonding for large probe marks by the RSM and desirability function approach

Chiu

Wang

2022

Int J Adv Manuf Technol

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Wire bonding is key to high-quality IC assembly in semiconductor packaging. An electrical test was conducted before wire bonding. During the electrical test, the needle probes touched the surface of each bond pad resulting in a probe trace left, called probe marks. The probe mark on the bond pad affects the adhesion between the bond pad and copper ball. Generally, the bond ball can be removed easily under shear testing if the ratio of probe mark area to pad area is greater than 20%. A large probe mark causes a defect in the yield. However, rejecting the orders of wafer batches with large probe marks will result in a loss of market share and good relationships with clients. In order to find the optimal parameter settings for the batches of chips with probe mark areas larger than 20% and deal with multiple response problems, this study aims to optimize the parameters of operation for the IC with large probe marks in the wire bonding process to improve process capability and production yield. Response surface methodology (RSM) optimization with the desirability function approach was introduced into the central composite design to obtain the optimal process parameters efficiently and eliminate defects. The optimal parameter settings for the four factors were determined as follows: 90 mA bond power, 12 ms bond time, 10 g bond force, and 180 °C bond temperature. The validation testing confirms that optimal parameter settings increase yield from 98.84% to 99.94% with good process capability, helping companies improve quality, reduce defect costs, and improve customer relationships.

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Section: Introductionmentioning

confidence: 99%

Multi-response optimization of IC wire bonding for large probe marks by the RSM and desirability function approach

Chiu

Wang

2022

Int J Adv Manuf Technol

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Smart Cantilever Probe with Integrated Force and Acoustic Emission Sensor

Tremmel,

Nagler,

Kutter

et al. 2023

2023 Ieee Sensors

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Detection of Bond Pad Discolorations at Outgoing Wafer Inspections

Chua¹,

Mohamaddan²,

Tanjong³

et al. 2018

IEEE Trans. Semicond. Manufact.

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Deployment of an automatic visual inspection system in semiconductor industry has become increasingly popular than ever not only due to its relatively high value as a yield analysis tool of outgoing products but more importantly for the prevention of defect escapee. A lot of studies are done on the application of in-line defect scan but the application of outgoing wafer inspection at post-fab environment has been very limited and rarely found in literature. With rapid growth of automotive application in worldwide industry, the importance of quality of the wafer at die level has never been so critical. This paper provides a method for detection of bond pad discolorations at outgoing quality check especially in semiconductor industry. An effective method for detection of the bond pad discolorations was proposed. The advantages and disadvantages of the detection method are discussed. Factors that are affecting the performances of the detection method are also described and analyzed.

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Fast and efficient method to detect probe mark and wire bond induced pad damage

Cited by 4 publications

References 0 publications

Multi-response optimization of IC wire bonding for large probe marks by the RSM and desirability function approach

Multi-response optimization of IC wire bonding for large probe marks by the RSM and desirability function approach

Smart Cantilever Probe with Integrated Force and Acoustic Emission Sensor

Detection of Bond Pad Discolorations at Outgoing Wafer Inspections

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