Failure Morphology After Drop Impact Test of Ball Grid Array (BGA) Package With Lead-Free Sn–3.8Ag–0.7Cu and Eutectic SnPb Solders

Jang, Jin-Wook; Silva, A.P. De; Drye, J.; Post, Scott; Owens, N.; Lin, Jane; Frear, D. R.

doi:10.1109/tepm.2006.890643

Cited by 28 publications

(9 citation statements)

References 11 publications

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“…10e were coarser after 1000 h of thermal aging. However, since the fracture path of the as-soldered specimens was located in the bulk solder, as reported in the literature, 20,21 this demonstrates that the morphology predominantly presented a ductile fracture mode without the occurrence of IMCs at the root of the dimples, as shown in Fig. 10g.…”

Section: Observation Of Impact-induced Fracture Surfacesupporting

confidence: 70%

Effect of Thermal Aging on Impact Absorbed Energies of Solder Joints Under High-Strain-Rate Conditions

Zhang

Shi

Liu

et al. 2009

Journal of Elec Materi

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This study was concerned with the effect of thermal aging on the impact properties of solder joints. Three kinds of solders, conventional Sn-37Pb solder, Sn-3.8Ag-0.7Cu solder, and Sn-3.8Ag-0.7Cu doped with rare-earth (RE) elements, were selected to manufacture joint specimens for the Charpy impact test. U-notch specimens were adopted and isothermally aged at 150°C for 100 h and 1000 h, and then impacted by using a pendulum-type impact tester at room temperature. The Sn-37Pb solder joints exhibited higher performance in terms of impact absorbed energy in the as-soldered and 100 h thermally aged conditions. Interestingly, the Sn-3.8Ag-0.7Cu solder joints exhibited improved performance for the impact value after 1000 h of thermal aging. For the Sn-37Pb and Sn-3.8Ag-0.7Cu solder joints, the impact absorbed energies initially increased when the storage duration was limited to 100 h, and then gradually decreased with its further increase. For the Sn-3.8Ag-0.7Cu-RE specimens, impact performance decreased directly with increasing thermal aging. Furthermore, scanning electron microscopy (SEM) observation showed that the fracture paths were focused on the interface zone for the three kinds of joints in the aged conditions. For the Sn-37Pb joints, the fracture surfaces mainly presented a ductile fracture mode. For the Sn-3.8Ag-0.7Cu joints, with microstructure coarsening, crack propagation partly shifted towards the Sn/Cu 6 Sn 5 interface. Compared with the 100 h aged joints, the area fraction of intergranular fracture of Sn grains on the Sn-3.8Ag-0.7Cu fracture surfaces was increased when the aging time was 1000 h. On the contrary, the fracture morphologies of Sn-3.8Ag-0.7Cu-RE were mainly brittle as thermal aging increased. Thus, an interrelationship between impact energy value and fracture morphology was observed.

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Section: Observation Of Impact-induced Fracture Surfacesupporting

confidence: 70%

Effect of Thermal Aging on Impact Absorbed Energies of Solder Joints Under High-Strain-Rate Conditions

Zhang

Shi

Liu

et al. 2009

Journal of Elec Materi

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“…Failure of solder due to drop and impact of the components has emerged to be an important issue to the industry in recent years (see, e.g., [1][2][3][4][5][6][7][8][9][10][11][12][13]). This is different from the traditional thermomechanical fatigue problem, since the loading rate involved in drop and impact can be several orders of magnitude higher than that during thermal cycling.…”

Section: Introductionmentioning

confidence: 99%

“…Rather, it is the flexural bending of the circuit board that forces the solder to undergo large deformation [7,10,12,13]. Thus, depending on the geometry and material of the test vehicle, detailed test condition or real-life drop scenario, and the location of the particular joint of interest, solder joints can experience shear, compression, tension and their combination during the dynamic loading history.…”

Section: Introductionmentioning

confidence: 99%

Numerical study of ductile failure morphology in solder joints under fast loading conditions

Shen

Aluru

2010

Microelectronics Reliability

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“…The rapid increase in the number of miniaturized consumer electronics which can be easily dropped by the user has resulted in significant interest in the impact response of such interconnects. [1][2][3][4][5][6][7][8][9][10][11][12][13][14][15] Impact reliability tests carried out by dropping the device, either once or a specific number of times, from a chosen height provide a simple means of quantitative joint system evaluation. 16 However, such studies do not provide sufficient information to select solder materials and/or joint geometries for improving the impact reliability of solder interconnects.…”

Section: Introductionmentioning

confidence: 99%

“…Therefore, in some recent studies, impact loading was carried out at the board level, with several joints present in a ball grid array simultaneously subjected to a single impact. [10][11][12][13][14][15] However, under such conditions the true impact loading experienced by any individual solder joint is difficult to access and quantify. Another important consideration is that these drop tests and board-level impact studies are conducted on asmanufactured parts, where results are more applicable to providing the impact reliability in handling and shipping of electronic components.…”

Section: Introductionmentioning

confidence: 99%

Impact Behavior of Thermomechanically Fatigued Sn-Based Solder Joints

Kobayashi

Lee

Subramanian

2009

Journal of Elec Materi

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Impact behavior of Sn-3 wt.%Ag-0.5 wt.%Cu (SAC 305) solder joints subjected to thermomechanical fatigue in different temperature regimes was investigated. This study was aimed at understanding the roles of distributed cracks that develop near the solder/substrate interface region during early stages of thermal excursions. Two specimen geometries were employed to evaluate mode I and mode II types of fracture under impact in solder joints several hundred microns thick. The peak stress that could be withstood in mode I fracture under impact decreased with increasing number of thermomechanical fatigue cycles, while mode II fracture was insensitive to the same. No observable influence on the impact strength due to the temperature regimes was noted. However, the fracture surfaces of specimens subjected to thermal excursions at the lower-temperature regime were predominantly along the Cu 6 Sn 5 /solder interface, while specimens subjected to the higher-temperature regime predominantly fractured along the Sn-Sn grain boundaries. These observations are consistent with the findings of prior studies dealing with damage accumulation in the early stages of thermal excursions in these temperature regimes.

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Failure Morphology After Drop Impact Test of Ball Grid Array (BGA) Package With Lead-Free Sn–3.8Ag–0.7Cu and Eutectic SnPb Solders

Cited by 28 publications

References 11 publications

Effect of Thermal Aging on Impact Absorbed Energies of Solder Joints Under High-Strain-Rate Conditions

Effect of Thermal Aging on Impact Absorbed Energies of Solder Joints Under High-Strain-Rate Conditions

Numerical study of ductile failure morphology in solder joints under fast loading conditions

Impact Behavior of Thermomechanically Fatigued Sn-Based Solder Joints

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