Failure modeling of BGA package for reliability evaluation of handheld products under drop event

Soonwan,; Kwak, Jae B.; Oh, Seunghee; Kang, Changsun

doi:10.1109/esime.2012.6191799

2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems 2012

DOI: 10.1109/esime.2012.6191799

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Failure modeling of BGA package for reliability evaluation of handheld products under drop event

Soonwan Soonwan

Jae B. Kwak

Seunghee Oh

et al.

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Failure modeling of BGA package for reliability evaluation of handheld products under drop event

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References 8 publications

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