Failure mechanisms of sintered silver interconnections for power electronic applications

Herboth, Thomas; Guenther, Michael; Fix, Andreas; Wilde, Juergen

doi:10.1109/ectc.2013.6575789

Cited by 66 publications

(24 citation statements)

References 11 publications

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“…However, by virtue of including many pores in s-Ag, it is very difficult to finely estimate the mechanical behaviors. To date, many researchers have tried to examine how porous affect the mechanical properties of s-Ag [ 5 , 6 , 7 , 8 , 9 , 10 , 11 , 12 , 13 , 14 , 15 , 16 , 17 , 18 , 19 ] by means of indentation test [ 20 ] and bending test [ 21 , 22 , 23 ]. Although the tensile test is one of the most basic mechanical property evaluation tests, these alternative mechanical tests have been utilized for the evaluation due to its technical simplicities.…”

Section: Introductionmentioning

confidence: 99%

Temperature Dependence on Tensile Mechanical Properties of Sintered Silver Film

et al. 2020

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This paper investigates the influence of temperature on tensile mechanical properties of sintered silver (s-Ag) films with 8–10 μm in thickness for fundamental reliability design of semiconductor systems. The s-Ag film sintered under a pressure of 60 MPa possesses the porosity (p) around 5% determined from cross-sectional scanning electron microscope (SEM) images. The stress–strain (S-S) curves of s-Ag and pure silver (p-Ag) films are obtained using originally designed uniaxial tensile tester at temperatures from 25 °C to 150 °C. The S-S curves of p-Ag indicate ductile behavior irrespective of temperature, whereas those of s-Ag indicate brittle-ductile transition at 120 °C. Compared with p-Ag, s-Ag possesses low Young’s modulus (E) and high ultimate tensile strength (UTS) below 80 °C. The mechanism of brittle-ductile transition is discussed based on fracture surface observation results.

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Section: Introductionmentioning

confidence: 99%

Temperature Dependence on Tensile Mechanical Properties of Sintered Silver Film

et al. 2020

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“…Additionally this study is concluded with a reliability based design optimisation on sintered silver structure. Herboth's experimental observation in [3] was in contrast to the experimental observation discussed by DeVoto et al [4]. In DeVoto's article, it was reported that experimental observation of perimeter delamination of sintered silver layer as function of number of thermal cycles.…”

Section: Introductionmentioning

confidence: 81%

“…The observation concluded that primary failure mechanism of sintered layer was due to deformation by plasticity and the fracture mechanism in the sintered layer was intergranular fracture caused by the grain boundary porosity [3]. This observation motivated us to conduct a finite element analysis on sintered silver structural model in the hope of replicating these observations.…”

Section: Introductionmentioning

confidence: 93%

“…Experimental observations of power module with thin sintered silver layer (20 μm) as die attach material subject to thermal cyclic loading are listed below from the study by Herboth et al [3]  Cracks initiated and propagated into interconnected network cracks  Cracks penetrated through the sintered Ag layer nearly vertically…”

Section: Introductionmentioning

confidence: 99%

“…A simplified relationship for residual curvature versus joint size was also proposed with number of assumptions and FEA result was compared with experimental results [7]. In Herboth's article [3] a 3D FEA was conducted using a linear elastic fracture mechanics based crack initiation and propagation model and concluded that maximum stress intensity is related to diameter of the sintered silver joint for same substrate size. Another Herboth article [8] discusses a FEA on sintered layer structure and concluded that the cracks initiate at the edges of the die/sintered layer interface.…”

Section: Introductionmentioning

confidence: 99%

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Sintered silver finite element modelling and reliability based design optimisation in power electronic module

Rajaguru

Bailey

2015

Microelectronics Reliability

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This paper discusses the design for reliability of a sintered silver structure in a power electronic module based on the computational approach that composed of high fidelity analysis, reduced order modelling, numerical risk analysis, and optimisation. The methodology was demonstrated on sintered silver interconnect sandwiched between silicon carbide chip and copper substrate in a power electronic module. In particular, sintered silver reliability due to thermal fatigue material degradation is one of the main concerns. Thermomechanical behaviour of the power module sintered silver joint structure is simulated by finite element analysis for cyclic temperature loading profile in order to capture the strain distribution. The discussion was on methods for approximate reduced order modelling based on interpolation techniques using Kriging and radial basis functions. The reduced order modelling approach uses prediction data for the thermo-mechanical behaviour. The fatigue lifetime of the sintered silver interconnect and the warpage of the interconnect layer was particular interest in this study. The reduced order models were used for the analysis of the effect of design uncertainties on the reliability of the sintered silver layer. To assess the effect of uncertain design data, a method for estimating the variation of reliability related metrics namely Latin Hypercube sampling was utilised. The product capability indices are evaluated from the distributions fitted to the histogram resulting from Latin Hypercube sampling technique. A reliability based design optimisation was demonstrated using Particle Swarm Optimisation algorithm for constraint optimisation task consists of optimising two different characteristic performance metrics such as the thermo-mechanical plastic strain accumulation per cycle on the sintered layer and the thermally induced warpage.

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