Failure Mechanisms of Direct Copper Bonding Substrates (DCB)

Gunther, Michael F.; Wolter, Klaus‐Jürgen; Rittner, Martin; Nüchter, W.

doi:10.1109/estc.2006.280090

Cited by 16 publications

(2 citation statements)

References 2 publications

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“…In [22], delaminations in the solder between the DBC and the base plate appeared after only 25 cycles between -40 °C and 120 °C. In [23], catastrophic failures due to cracks in the ceramic were observed after 200 to 300 -40 °C/150 °C cycles. Similar results were reported in [24,25].…”

Section: Resultsmentioning

confidence: 99%

Experimental investigation of the reliability of Printed Circuit Board (PCB)-embedded power dies with pressed contact made of metal foam

Pascal

Labrousse

Petit

et al. 2018

Microelectronics Reliability

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A Printed Circuit Board (PCB)-embedding process using pressed metal foam to connect the top-side pads of power dies is considered. The manufacturing process, simple and highly cost-effective, is described in detail; samples are manufactured and their reliability and robustness are characterised. It is shown that thermally cycled prototypes exhibit reliability close to that of Direct Bounded Copper (DBC) substrates. Samples submitted to 150 A-surges have highly scattered reliability. SiC MOSFETs submitted to destructive current limiting tests and repetitive short-circuit tests performed similarly to dies reported in TO247 packages. A discussion on the development of reliability-assessment-methods, especially suited for PCB-embedding processes, is proposed.

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Section: Resultsmentioning

confidence: 99%

Experimental investigation of the reliability of Printed Circuit Board (PCB)-embedded power dies with pressed contact made of metal foam

Pascal

Labrousse

Petit

et al. 2018

Microelectronics Reliability

View full text Add to dashboard Cite

show abstract

“…During large amplitude thermal cycling (300°C), it has been found that 20 to 30 cycles are typically needed to crack or spall Direct Bonded Copper (DBC) substrates made of Al2O3 or AlN ceramics [9]. The CTE mismatch between Cu and the ceramic as well as the copper hardening due to the plastic deformation result in the fracture of the ceramic and the peel off of the Cu foil [10] [11]. The use of Si3N4 ceramics with copper bonded using Active Metal Brazing (AMB) technology improves the substrate reliability [12] [13], but the Si3N4 thermal conductivity is half of the AlN one and hence thin ceramic plates should be used.…”

Section: Introductionmentioning

confidence: 99%