Failure and failure characterization of QFP package interconnect structure under random vibration condition

Hu, Jiaxing; Jing, Bo; Sheng, Zengjin; Fang, Lü; Chen, Yaojun; Zhang, Yulin

doi:10.1016/j.microrel.2018.08.011

Cited by 14 publications

(15 citation statements)

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“…Equations (16), (19), and (22) model the relationship between the failure time (t n ), strain (ε), and strain amplitude (∆ε), under the three failure modes of the chip solder joint. By obtaining the strain and strain amplitude of the solder joint under different coupled stress, the failure time, t n , of the solder joint can be predicted.…”

Section: Model Verification and Error Discussionmentioning

confidence: 99%

“…In order to ensure the accuracy of the calculation results and the reasonableness of the calculation scale, the influences of combination reaction of solder mask, pad, and solder are ignored in modeling. At the same time, we assume that the package component is ideal [18,19,35,36]. Before the fatigue test, the residual stress of the test piece is eliminated through vibration aging method, according to GB/T 25712-2010 [37], so we do not consider the effect of residual stress during simulation.…”

Section: Finite Element Simulationmentioning

confidence: 99%

“…12 A Cu ε 3 + e 3.747 ∆ε 3 0.7087 (19) The relationship between ln(da/dN) and ln(∆ε) under Cu is as follows:…”

Section: Modeling Of Crack Propagation Stagementioning

confidence: 99%

“…The crack length of solder joint under FM2 is shown in Figure 15. Then, the crack propagation time under FM2 is determined by the crack which has longer propagation time, as follows: The failure time of the solder joint under FM2 is calculated as follows: Equations (16), (19), and (22) model the relationship between the failure time ( n t ), strain ( ε ), and strain amplitude ( Δε ), under the three failure modes of the chip solder joint. By obtaining the strain and strain amplitude of the solder joint under different coupled stress, the failure time, n t , of the solder joint can be predicted.…”

Section: Modeling Of Crack Propagation Stagementioning

confidence: 99%

“…Some studies used finite element simulation to analyze the origin of cracks in solder joints. For example, Huang [18] and Jiaxing et al [19] performed QFP joint stress-strain simulations under single stress and found that the concentrated location of stress-strain was coincided with the actual crack location.…”

Section: Introductionmentioning

confidence: 99%

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Study on Establishing Degradation Model of Chip Solder Joint Material under Coupled Stress

Jing

2020

Materials

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The chip is the core component of the integrated circuit. Degradation and failure of chip solder joints can directly lead to function loss of the integrated circuit. In order to establish the degradation model of chip solder joints under coupled stress, this paper takes quad flat package (QFP) chip solder joints as the study object. First, solder joint degradation data and failure samples were obtained through fatigue tests under coupled stress. Three types of micro failure modes of solder joints were obtained by scanning electron microscope (SEM) analysis and finite element model (FEM) simulation results. Second, the characterization of degradation data was obtained by the principal component of Mahalanobis distance (PCMD) algorithm. It is found that solder joint degradation is divided into three stages: strain accumulation stage, crack propagation stage, and failure stage. Later, Coffin–Manson model and Paris model were modified based on the PCMD health index and strain simulation. The function relationship between strain accumulation time, crack propagation time, and strain was determined, respectively. Solder joint degradation models at different degradation stage were established. Finally, through strain simulation, the models can predict the strain accumulation time and failure time effectively under each failure mode, and their prediction accuracy is above 85%.

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Section: Model Verification and Error Discussionmentioning

confidence: 99%