Microstructural and optical properties of aluminum oxide thin films prepared by off-plane filtered cathodic vacuum arc system J. Vac. Sci. Technol. A 21, 906 (2003); 10.1116/1.1577132 Structure and mechanical properties of tungsten carbide films deposited by off-plane double bend filtered cathodic vacuum arc Influence of substrate bias on the structure and properties of (Ti,Al)N films deposited by filtered cathodic vacuum arc J.Establishing the relationship between process, structure, and properties of TiN films deposited by electron cyclotron resonance assisted reactive sputtering. I. Variations in hardness and roughness as a function of process parameters ͑Ti, Al͒N films were deposited by a new off-plane double bend filtered cathodic vacuum arc technique under a nitrogen atmosphere at room temperature. Scanning electron microscopy and atomic force microscopy were used to observe the surface morphology of the deposited films. X-ray photoelectron spectroscopy was used to determine the composition and bonding structure of the deposited films. A scratch test was used to access the film adhesion. The deposited films are atomically smooth and particle free. The Al/Ti atomic ratio in the deposited films is around 1. The films deposited at the pressure of 1ϫ10 Ϫ4 Torr are composed of metallic Ti and Al phase and a small amount of ͑Ti, Al͒N phase. For the films deposited at the pressure of 1.5ϫ10 Ϫ3 Torr, ͑Ti, Al͒N phases are dominant. The scratch test indicates that the critical load increases with increasing deposition pressure up to 1.5ϫ10 Ϫ3 Torr, then decrease drastically with the further increase of deposition pressure. As substrate bias is increased, critical load increases and reachs the maximum at the bias of 200 V, then decreases at higher bias. The hardness of the deposited films is found to be the main factor that affects the critical load of the thin films.