Failure Analysis for Vibration Stress on Ball Grid Array Solder Joints

Zhao, Zhiqiang; Hu, Chaohui; Yin, Fengwei

doi:10.1109/icept.2018.8480428

Cited by 7 publications

(4 citation statements)

References 2 publications

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“…The findings strongly agree with published literature. 31,34 Other reports support these findings, 30,32,35 and demonstrate validation of the current study using solder marks defined (SMD) and non-solder marks defined (NSMD) pad designs in BGA assembly, 31,34 which represents NSMD pad assembly, confirming cracks at the periphery of the joints. In contrast, other studies, which depict SMD pad assembly similar to the pad design in the current study, also confirm cracking at the identical location.…”

Section: Study On Elastic Strain Response Of Solder Joints Subjected ...supporting

confidence: 81%

“…The location of fatigue cracks occurs at either the top, bottom, or both sides of BGA solder joints. 30,31,32,34,35 This observation accounts for the pad geometric factor, specifically, component standoff height. Many researchers have reported the causes and location of fatigue cracks in BGA solder joints.…”

Section: Study On Elastic Strain Response Of Solder Joints Subjected ...mentioning

confidence: 99%

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Characterising Solder Materials from Random Vibration Response of Their Interconnects in BGA Packaging

Depiver

Mallik

Amalu

2023

J. Electron. Mater.

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Solder interconnection in electronic packaging is the weakest link, thus driving the reliability of electronic modules and systems. Improving interconnection integrity in safety-critical applications is vital in enhancing application reliability. This investigation qualifies the random vibration response of five essential solder compositions in ball grid array (BGA) solder joints used in safety-critical applications. The solder compositions are eutectic Sn63Pb37 and SnAgCu (SAC) 305, 387, 396, and 405. Computer-aided engineering (CAE) employing ANSYS finite element analysis and SolidWorks software is implemented in this investigation. The solder Sn63Pb37 deformed least at 0.43 µm, followed by SAC396 at 0.58 µm, while SAC405 deformed highest at 0.88 µm. Further analysis demonstrates that the possession of a higher elastic modulus and mass density culminates in lower solder joint deformation. Stress is concentrated at the periphery of the solder joints in contact with a printed circuit board (PCB). The SAC396 solder accumulates the lowest stress of 14.1 MPa, followed by SAC405 at 17.9 MPa, while eutectic Sn63Pb37 accrues the highest at 34.6 MPa. Similarly, strain concentration is found at the interface between the solder joint and copper pad on a PCB. SAC405 acquires the lowest elastic strain magnitude of 0.0011 mm/mm, while SAC305 records the highest strain of 0.002 mm/mm. These results demonstrate that SAC405 solder has maximum and SAC387 solder has minimum fatigue lives.

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Section: Study On Elastic Strain Response Of Solder Joints Subjected ...supporting

confidence: 81%

Section: Study On Elastic Strain Response Of Solder Joints Subjected ...mentioning

confidence: 99%

Characterising Solder Materials from Random Vibration Response of Their Interconnects in BGA Packaging

Depiver

Mallik

Amalu

2023

J. Electron. Mater.

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“…Most of the components in the PCB of the electromechanical equipment studied in this paper are packaged using a plastic ball grid array (PBGA). There is the research showing that the mechanical stress resistance of the PBGA solder joint is poor, and it cracks easily under continuous vibration stress, which leads to product failure [ 46 ]. At the same time, according to the life prediction method of electronic components proposed by Steinberg, the weakest link and the most likely failure in the PCB under dynamic loading will be the connection between the component and the substrate.…”

Section: Fatigue Life Analysis Of Equipmentmentioning

confidence: 99%

Research on the Reliability of a Core Control Unit of Highway Electromechanical Equipment Based on Virtual Sensor Data

Lin

Luo

et al. 2022

Sensors

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The printed circuit board (PCB) is the core control unit of electromechanical equipment. In order to determine the influence of the coupling vibration caused by vehicle–road interaction on the PCB reliability of roadside electromechanical equipment, first, the dynamic load of the vehicle tire is solved by establishing the dynamic model of a vehicle road. Then, the acceleration response data generated by road vibration are obtained by solving the road finite element model. Finally, the power density spectrum of the acceleration response is taken as input excitation, and the deformation response of the PCB under vehicle–road coupling vibration is analyzed. The experimental results show that when the vehicle is driving close to the roadside, the vibration caused by vehicle–road coupling will lead to a large deformation of the PCB, and the deformation value reaches 0.170 mm, which can cause structural damage to the PCB. This shows that the vehicle–road coupling vibration can affect the reliability of the roadside electromechanical equipment; thus, the optimal design of the PCB layout is created. After optimization, the first-order modal frequency of the PCB is increase by 5.4%, which reduces the risk of the components breaking away from the PCB substrate.

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“…A considerable number of studies has focused in computing resonant systems models in the field of structural analysis, such as in El-Gazzar (2017); Dou and Jensen (2015); Ruzziconi et al (2013). An important challenge facing researchers is that to investigate and monitor the effect of oscillations in the system's stability (Zhao et al, 2018;Yao and Li, 2015). Likewise, in the area of energy supply, given the growing complexity in operating power grids, to supervise the stability of the system became increasingly important.…”

Section: Introductionmentioning

confidence: 99%

On the use of Frequency-Domain Subspace-based System Identification for Estimating Resonant Systems

Rodrigues

Oliveira

Santo³

2019

Anais Do 14º Simpósio Brasileiro De Automação Inteligente

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In this paper, a parametric identification of high order resonant systems from frequency response data is analyzed. Among many techniques for obtaining black-box models for such systems, subspace-based algorithms stand out. Subspace methods uses geometric projections to obtain specific information necessary to compute the system extended observability matrix and, eventually, to obtain a state-space model representation. Throughout the paper, the method is also shown to use only well conditioned matrices to avoid numerical problems with high order models. The validity of the algorithm is firstly demonstrated on a simulated data of a synthetic 15th order system. Then, in order to state the systems effectiveness, the method is applied to actual data extracted from a resonant beam.

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Failure Analysis for Vibration Stress on Ball Grid Array Solder Joints

Cited by 7 publications

References 2 publications

Characterising Solder Materials from Random Vibration Response of Their Interconnects in BGA Packaging

Characterising Solder Materials from Random Vibration Response of Their Interconnects in BGA Packaging

Research on the Reliability of a Core Control Unit of Highway Electromechanical Equipment Based on Virtual Sensor Data

On the use of Frequency-Domain Subspace-based System Identification for Estimating Resonant Systems

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