Factorial Analysis of Chip-on-Metal WLCSP Technology with Fan-Out Capability

Abstract

In this study, a wafer level chip scaledpackaging chip scaled package applying the factorial analysis. All of (WLCSP) having the capability ofredistributing the electrical these proposals are focused on enhancing flip-chip type circuit is proposed to resolve the problem of assembling a packaging reliability. However, the problem about fine-pitched chip to a coarse-pitched substrate. In thefan-out assembling a fine-pitched chip to a coarse-pitched substrate WLCSP, the solder bumps could be located on both thefiller remains and has become another vital issue in advanced polymer and chip surface. The concept ofthefan-out WLCSP packaging recently. and the processes offabricating the novel fan-out WLCSP Yuan et al. [7][8] have proposed a glass WLCSP to resolve the would be described. In addition, the reliability characteristic challenge faced by packaging house transferring the 12-inch of the fan-out WLCSP in packaging level is described by semiconductor wafer into 8-inch packaging equipments.using the two-dimensional finite element model. The 25 However, the developing manner still has reliability problems factorial designs with the analysis ofvariance (ANOVA) are and could be further improved. In this study, the fan-out type conducted to obtain the sensitivity information of the WLCSP, which fabricated based on preceding technology packaging. was proposed. In the fan-out WLCSP, the chip is first attached to a specific chip carrier, and then the trench between

A study of material effects for the panel level package (PLP) technology

“…In the PLP, the solder on polymer (SOP) structure is developed to expand the chip area and also provide a buffer layer for the deformation energy from the CTE mismatch. From the investigations [8][9][10], it is shown that the thermo-mechanical behavior of the PLP is different from the conventional WLP due to the application of new materials and structure. The concerned reliability issue is the undesired crack at the redistribution lines, and the major driving force is the CTE mismatch between the applied materials in the PLP.…”

The solder on rubber (SOR) interconnection design and its reliability assessment based on shear strength test and finite element analysis

“…In this study, a novel chip-on-metal concept, the fan-out type WLCSP [9,10], is proposed to resolve the mechanical issues involved in advanced WLCSP. In WLCSP, the solder on rubber (SOR) design is developed to expand the chip area and also provide a buffer layer for the deformation energy from the CTE mismatch.…”