In this study, poly(methyl methacrylate)
(PMMA)/polylactic acid
(PLA)/boron nitride (BN) composites were fabricated by melt blending
and solution blending, respectively. When the content of BN achieved
20%, the thermal conductivities of both in-plane and out-of-plane
were found to increase considerably by 303 and 334%, respectively.
Scanning electron microscopy (SEM) observations substantiated that
a thermal conduction path could be in situ established at a filler
content of 20% in the composites prepared by solution blending, which
was earlier than that established in the composites prepared by melt
blending. Analysis based on the results of both transmission electron
microscopy (TEM) and SEM after a selective etching of the composites
proved that BN was selectively distributed in the PLA phase, making
it possible to prepare composites with greatly enhanced thermal conductivity
(TC) via altering the mixing order of preparing the route. More importantly,
our findings suggested that there exists a direct scaling between
mechanical properties and TC, which could clearly be expressed by
a linear master curve. The present work will provide insight into
the industrial manufacturing of PMMA/PLA/BN composites, which could
be potentially applicable in electronic devices, e.g., 2.4G/5G routers,
notebook keyboards, etc.