Facile Preparation of Monodisperse, Impurity-Free, and Antioxidation Copper Nanoparticles on a Large Scale for Application in Conductive Ink

Abstract

Monodisperse copper nanoparticles with high purity and antioxidation properties are synthesized quickly (only 5 min) on a large scale (multigram amounts) by a modified polyol process using slightly soluble Cu(OH)2 as the precursor, L-ascorbic acid as the reductant, and PEG-2000 as the protectant. The resulting copper nanoparticles have a size distribution of 135 ± 30 nm and do not suffer significant oxidation even after being stored for 30 days under ambient conditions. The copper nanoparticles can be well-dispersed in an oil-based ink, which can be silk-screen printed onto flexible substrates and then converted into conductive patterns after heat treatment. An optimal electrical resistivity of 15.8 μΩ cm is achieved, which is only 10 times larger than that of bulk copper. The synthesized copper nanoparticles could be considered as a cheap and effective material for printed electronics.

Synthesis of CuNP-modified carbon electrodes obtained by pyrolysis of paper

“…Although improved performance is commonly reported, the high cost and the limited availability of some of these materials can impose restrictions to the development of sensors for low-income communities. Aiming to address these limitations, other metallic nanomaterials such as copper nanoparticles (CuNPs) have emerged as alternative materials with potential applications in catalysis [17, 18], electronics [19, 20], optics [21], and medicine [22, 23]. Despite their potential toxicity [24], CuNPs are relatively inexpensive and provide access to a number of chemical routes for their derivatization.…”

Highly stable and re-dispersible nano Cu hydrosols with sensitively size-dependent catalytic and antibacterial activities

“…[1][2][3][4][5][6][7] Among these materials, nano copper has always been a hot issue specifically due to its low processing costs and potential applications in lubrication, electrical and thermal conductivity, nanofluids, and catalytic reactions, [8][9][10][11][12] while the basic properties of Cu colloidal particles mainly depend on their size, shape, crystallinity and structure, which exactly determine their practical applications. [1][2][3][4][5][6][7] Among these materials, nano copper has always been a hot issue specifically due to its low processing costs and potential applications in lubrication, electrical and thermal conductivity, nanofluids, and catalytic reactions, [8][9][10][11][12] while the basic properties of Cu colloidal particles mainly depend on their size, shape, crystallinity and structure, which exactly determine their practical applications.…”

Preparation of Cu@SiO2 composite nanoparticle and its tribological properties as water‐based lubricant additive

“…Usually, reducing agents such as hydrazine hydrate and citric acid can be adopted to reduce Cu 2+ , thereby avoiding the oxidation of Cu nanoparticles and retaining the original morphology of Cu@SiO 2 nanoparticles. Figures S2–S4 show the TEM images of Cu@SiO 2 nanoparticles obtained in the presence of hydrazine hydrate, citric acid and ascorbic acid as the reducing agents . To our disappointment, the introduction of even microscale amounts of reducing agent causes damage to the structure of the as‐prepared Cu@SiO 2 nanoparticles.…”