Homogeneously dispersed copper nanowire
(CuNW) materials
are the
basis for practical applications in many types of electronic devices.
At present, the dispersion of CuNWs in water is achieved through polymeric
spatial site resistance effects primarily and the electrostatic dispersion
mechanism in a few. However, the electrical conductivity of CuNWs
could be weakened by the excessive addition of polymers; therefore,
it is difficult to maintain a stable dispersion enduringly for surface
charge modifiers. Based on the coagulation mechanism of colloids,
a novel antisedimentation mechanism is refined by this work. Directed
by this mechanism, a stable reciprocal-supporting antisedimentation
conductive CuNW ink was achieved enduringly and a uniform conductive
coating (1.81–5.65 Ω·sq–1) was
successfully manufactured. The tannic acid–polyethylene imine
(TA-PEI) could support copper nanowires to maintain a stable height
of 61.4% after 15 days best, while CuNWs in other systems would settle
completely in one day. Meanwhile, the TA-PEI composite cluster antisedimentation
network not only provided massive spatial potential resistance for
CuNWs but also modified the surface charge of CuNWs. CuNWs were dispersed
stably in this phenol-amine@CuNW network. Furthermore, the CuNWs were
crosslinked more tightly with each other relying on the vigorous adhesive
properties of TA-PEI. With this antisedimentation mechanism and simple
treatment process, CuNW ink will be utilized in more applications.