Fabrication Process for PCBMEMS Capacitive Pressure Sensors Using the Cu Layer to Define the Gap

Souilah, Mohamed; Chaabi, Abdelhafid; Perdigones, Francisco; Quero, J.M.; Flores, Guadalupe; Lain, Mohamed Ras

doi:10.1109/jsen.2015.2503405

Cited by 5 publications

(2 citation statements)

References 30 publications

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“…The two electrodes were fabricated in the same copper layer. Another interesting application of the copper layer in the fabrication of sensors, in this case, a pressure sensor, is the gap definition [ 104 ], Figure 8 C. This structure uses the copper layer of 18

m to define the gap between electrodes. Several values of the copper layer can be chosen, if required for different capacitor gaps.…”

Section: Printed Circuit Boards For Electronics Sensors and Actuatorsmentioning

confidence: 99%

“…( C ) Cross-section view of a pressure sensor with the gap defined using the thickness of the copper layer (copyright (2015) IEEE. Reprinted, with permission, from [ 104 ]). ( D ) Sensor fabricated: (a) radiation patch on the upper surface; and (b) metallic ground on the lower surface (reprinted from [ 111 ], copyright (2018), Creative Commons License).…”

Section: Printed Circuit Boards For Electronics Sensors and Actuatorsmentioning

confidence: 99%

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Printed Circuit Boards: The Layers’ Functions for Electronic and Biomedical Engineering

Perdigones

Quero

2022

Micromachines

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This paper describes the fabrication opportunities that Printed Circuit Boards (PCBs) offer for electronic and biomedical engineering. Historically, PCB substrates have been used to support the components of the electronic devices, linking them using copper lines, and providing input and output pads to connect the rest of the system. In addition, this kind of substrate is an emerging material for biomedical engineering thanks to its many interesting characteristics, such as its commercial availability at a low cost with very good tolerance and versatility, due to its multilayer characteristics; that is, the possibility of using several metals and substrate layers. The alternative uses of copper, gold, Flame Retardant 4 (FR4) and silver layers, together with the use of vias, solder masks and a rigid and flexible substrate, are noted. Among other uses, these characteristics have been using to develop many sensors, biosensors and actuators, and PCB-based lab-on chips; for example, deoxyribonucleic acid (DNA) amplification devices for Polymerase Chain Reaction (PCR). In addition, several applications of these devices are going to be noted in this paper, and two tables summarizing the layers’ functions are included in the discussion: the first one for metallic layers, and the second one for the vias, solder mask, flexible and rigid substrate functions.

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m to define the gap between electrodes. Several values of the copper layer can be chosen, if required for different capacitor gaps.…”

Section: Printed Circuit Boards For Electronics Sensors and Actuatorsmentioning

confidence: 99%

Section: Printed Circuit Boards For Electronics Sensors and Actuatorsmentioning

confidence: 99%

Printed Circuit Boards: The Layers’ Functions for Electronic and Biomedical Engineering

Perdigones

Quero

2022

Micromachines

Self Cite

View full text Add to dashboard Cite

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Low cost SU-8 lift-off process to fabricate a gold/glass microelectrodes array for culturing applications

et al. 2021

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Highly integrable and normally open microvalve for industrial thermoplastic-based lab on PCB

Perdigones

Quero

2019

Sensors and Actuators A: Physical

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Fabrication Process for PCBMEMS Capacitive Pressure Sensors Using the Cu Layer to Define the Gap

Cited by 5 publications

References 30 publications

Printed Circuit Boards: The Layers’ Functions for Electronic and Biomedical Engineering

Printed Circuit Boards: The Layers’ Functions for Electronic and Biomedical Engineering

Low cost SU-8 lift-off process to fabricate a gold/glass microelectrodes array for culturing applications

Highly integrable and normally open microvalve for industrial thermoplastic-based lab on PCB

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