Fabrication of W–Cu composites by microwave infiltration

Characterization of fine-grained W–10wt.% Cu composite fabricated by hot-shock consolidation

“…In addition, high temperature (exceeding 1000°C) and long duration (over 1 h) are necessary for both LPS and LI methods, but leading to aggregation of Cu and microstructural coarsening [8]. Novel sintering techniques have been explored to improve W-Cu composite densifications, which includes plasma spraying [9], laser sintering [10], microwave sintering [8,11,12] and powder injection molding [13]; but the deterioration due to high sintering temperature and long processing time is still not overcome. Then methods utilizing ultra-high pressure are developed to fabricate W-Cu composites, such as Hot-pressing method [14] and resistance sintering [15,16], which apparently lower sintering temperature and shorten sintering time.…”

Preparation and properties of W–Cu–Zn alloy with low W–W contiguity

“…Infiltration (infiltrate Cu into W skeleton) is the most common process used in the preparation of tungstencopper alloy [5,6]. But the alloy prepared by infiltration has extremely high W-W contiguity, and it is well known that W-W interface has the weakest combination in tungsten alloy interfaces due to lack of metallurgical bonding, in which microcracks can be easily generated and expand under applied load and finally cause the failure of the materials [7].…”

Interface bonding performance of CuW alloy coating on Cu substrate

“…CuW/Cu composite is widely used in high voltage switch, relays, EDM electrodes and other electronic applications. [1][2][3] Because tungsten and copper are immiscible and the melting point of tungsten is very high, conventional preparation of CuW alloy is to sinter the mixed powders of copper and tungsten. But traditional powder metallurgy methods have encountered some difficulties, such as longer sintering time, higher temperature and higher energy consumption.…”