2014
DOI: 10.3791/51179-v
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Fabrication of Uniform Nanoscale Cavities via Silicon Direct Wafer Bonding

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Cited by 2 publications
(2 citation statements)
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“…This allows three-dimensional (3D) analysis and evaluation of pore segmentation capability, which will be demonstrated in this study. High temperature direct bonding has previously been demonstrated [8,9], which requires annealing temperatures above 1000 °C. In our study, we implemented a low temperature (≈ 400 °C) direct bonding [10,11].…”
Section: Lithography With Driementioning
confidence: 99%
“…This allows three-dimensional (3D) analysis and evaluation of pore segmentation capability, which will be demonstrated in this study. High temperature direct bonding has previously been demonstrated [8,9], which requires annealing temperatures above 1000 °C. In our study, we implemented a low temperature (≈ 400 °C) direct bonding [10,11].…”
Section: Lithography With Driementioning
confidence: 99%
“…The wafer bonding involves a two-step process whereby first a weak bond is achieved at room temperature, which allows one to examine via infrared imaging the quality and uniformity of the enclosure, and then a high-temperature annealing at one atmosphere of differential pressure between the inside and outside of the two-wafer cell. This results in a strong chemical bond at the interface between the wafers (Rhee et al 1990, Thomson et al 2014. Typically this is at the Si-SiO 2 interface, but also at times at the SiO 2 -SiO 2 interface.…”
Section: Measurement Techniquesmentioning
confidence: 99%