2021
DOI: 10.1088/1361-6463/ac27d3
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Fabrication of ultra-shallow junction by in situ doped amorphous silicon films and its application in silicon drift detectors

Abstract: In situ doped amorphous silicon film, deposited by plasma enhanced chemical vapor deposition, is employed as a diffusion source to form an ultra-shallow junction and as voltage dividers in silicon drift detectors. By controlling annealing temperature and time, the junction depth can be adjusted precisely, and the shallowest junction depth of 15 nm is achieved. The I-V characteristics of the ultra-shallow junction, fabricated with different annealing temperature, annealing time and doping concentration, are the… Show more

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Cited by 2 publications
(1 citation statement)
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“…Finally, the Al electrodes were deposited on the corresponding N+ and P+ regions of SDD by electron beam evaporation and metal lift-off process in acetone was performed to form the patterned metal contacts. Some detailed fabrication processes can be seen in these publications [17][18][19][20]. We fabricated the two square-SDD devices SDD-1 and SDD-2 by APCVD technology and their structures are shown in Figure 1a,b.…”
Section: Methodsmentioning
confidence: 99%
“…Finally, the Al electrodes were deposited on the corresponding N+ and P+ regions of SDD by electron beam evaporation and metal lift-off process in acetone was performed to form the patterned metal contacts. Some detailed fabrication processes can be seen in these publications [17][18][19][20]. We fabricated the two square-SDD devices SDD-1 and SDD-2 by APCVD technology and their structures are shown in Figure 1a,b.…”
Section: Methodsmentioning
confidence: 99%