Fabrication of the 3-D SU-8 fine micromesh and electroplated Ni micromesh structures

Sato, Hiroki; Houshi, Y.; Otsuka, Toshiharu; Shoji, Shuichi

doi:10.1109/imnc.2004.245664

Cited by 3 publications

(1 citation statement)

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“…6 shows two SEM images of some representative microstructures obtained using UV lithography of EPON resin 165 photoresist by following the foregoing processing steps. Our experiments have found that the lithography properties of EPON resin 165 photoresist are very close to those for SU-8 as published by our group [11,16,18,20,21,23,[26][27][28][29][30][31][32][33][34][35][36] and many other researchers [1][2][3][4][5][6][7][8][9][11][12][13][14][15][16][17][18][19]23,28,34,35,[37][38][39][40][41][42]. However, EPON resin 165 photoresist has a much shorter curing time.…”

Section: Materials and Lithography Properties Of Epon Resin 165supporting

confidence: 81%

A new UV lithography photoresist based on composite of EPON resins 165 and 154 for fabrication of high-aspect-ratio microstructures

Yang

Soper

Wang

2007

Sensors and Actuators A: Physical

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We report a new type of negative-tone photoresist in this paper. The resist is based on a composite of EPON resins 154 and 165 (both from Hexion Specialty Chemicals, Inc., Columbus, OH 43215). These two epoxy-based resins were mixed in an optimal ratio and dissolved in gamma-butyrolactone (GBL) solvent. The mixture was then photosensitized by adding a given amount of triaryl sulfonium salt to obtain a new negative-tone photoresist that can be used in for ultra-high-aspect-ratio microstructure fabrication with UV lithography. Preliminary studies have found that microstructures with heights of more than 1000 m and feature sizes down to 10 m (aspect-ratios of more than 100) can be obtained using the new resist film with ultraviolet lithography. The microstructures have excellent sidewall quality. In this paper, both the material properties and lithography properties of this new type of UV resist will be presented. The potential applications of the new resist in microfabrication and MEMS systems are also discussed.

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Section: Materials and Lithography Properties Of Epon Resin 165supporting

confidence: 81%

A new UV lithography photoresist based on composite of EPON resins 165 and 154 for fabrication of high-aspect-ratio microstructures

Yang

Soper

Wang

2007

Sensors and Actuators A: Physical

View full text Add to dashboard Cite

show abstract

A New Negative-Tone, UV Lithography Photoresist for Fabrication of Ultra-High-Aspect-Ratio Microstructures

Yang

Soper

Wang

2006

Microelectromechanical Systems

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We report a new type of negative-tone photoresist in this paper. The resist is based on the composite of EPON resins 154 165 (both from Hexion Specialty Chemicals, Inc., Columbus, OH 43215). These two epoxy resins were mixed in an optimal ratio and dissolved into the gamma-butyrolactone (GBL) solvent. The mixture was then photosensitized by adding a given amount of triaryl sulfonium salt to obtain the new negative tone photoresist that can be used in for ultra high aspect ratio microstructures with UV lithography. The preliminary study has found that microstructures with height of more than 1000 μm and feature sizes of 10 μm (aspect-ratios of more than 100) can be obtained using the new resist film with ultraviolet lithography. The microstructures have excellent sidewall quality. In this paper, both the material properties and lithography properties of this new type of UV resist will be presented. The potential applications of the new resist in microfabrication and MEMS systems are also discussed.

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Ultra-violet lithography of thick photoresist for the applications in BioMEMS and micro optics

Yang¹

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Fabrication of the 3-D SU-8 fine micromesh and electroplated Ni micromesh structures

Cited by 3 publications

References 0 publications

A new UV lithography photoresist based on composite of EPON resins 165 and 154 for fabrication of high-aspect-ratio microstructures

A new UV lithography photoresist based on composite of EPON resins 165 and 154 for fabrication of high-aspect-ratio microstructures

A New Negative-Tone, UV Lithography Photoresist for Fabrication of Ultra-High-Aspect-Ratio Microstructures

Ultra-violet lithography of thick photoresist for the applications in BioMEMS and micro optics

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