At present, micro electro mechanical systems (MEMS) show great promise in becoming key devices in many industrial fields, including automobiles, measuring instruments, medical electronics, etc.. It is easy to integrate IC with MEMS that are made on a Si substrate. New functions are expected to be created using MEMS in industry. Up to now, the main process technology that has been used for manufacturing of MEMS is Si anisotropic etching and poly-Si surface micromachining. MEMS are systems composed of essentially 3-D