Fabrication of strain gauge based sensors for tactile skins

Baptist, Joshua R.; Zhang, Ruoshi; Wei, Danming; Saadatzi, Mohammad Nasser; Popa, Dan O.

doi:10.1117/12.2262951

Cited by 14 publications

(10 citation statements)

References 18 publications

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“…For instance, stretch sensors can be mounted on a wearable device such as a prosthetic hand, data glove, or exoskeleton to provide vital information on the angular orientation of the joints, as illustrated in Figure 1. The use of traditional metallic and semiconducting techniques in this sensing field, though previously demonstrated [1][2][3], has limited potential due to the amount of stretch/strain that the device can undergo before fatigue, which in some areas might be well beyond the traditional strain sensor's capabilities. The term stretch and strain will be interchangeably used here.…”

Section: Introductionmentioning

confidence: 99%

The Development of Highly Flexible Stretch Sensors for a Robotic Hand

et al. 2018

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Demand for highly compliant mechanical sensors for use in the fields of robotics and wearable electronics has been constantly rising in recent times. Carbon based materials, and especially, carbon nanotubes, have been widely studied as a candidate piezoresistive sensing medium in these devices due to their favorable structural morphology. In this paper three different carbon based materials, namely carbon black, graphene nano-platelets, and multi-walled carbon nanotubes, were utilized as large stretch sensors capable of measuring stretches over 250%. These stretch sensors can be used in robotic hands/arms to determine the angular position of joints. Analysis was also carried out to understand the effect of the morphologies of the carbon particles on the electromechanical response of the sensors. Sensors with gauge factors ranging from one to 1.75 for strain up to 200% were obtained. Among these sensors, the stretch sensors with carbon black/silicone composite were found to have the highest gauge factor while demonstrating acceptable hysteresis in most robotic hand applications. The highly flexible stretch sensors demonstrated in this work show high levels of compliance and conformance making them ideal candidates as sensors for soft robotics.

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Section: Introductionmentioning

confidence: 99%

The Development of Highly Flexible Stretch Sensors for a Robotic Hand

et al. 2018

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“…Furthermore, mechanical stability and reliability is required, as well as a low thickness. In the research, printed and flexible electronic components are often mechanically connected using conventional crocodile clamps for laboratory tests, crimp connectors [32,33] and low/zero insertion force (LIF/ZIF) connectors [34,35]. For the hybrid integration of SMDs, classic lead-based soldering or bonding with conductive adhesives has been reported.…”

Section: Introductionmentioning

confidence: 99%

Evaluation of Standard Electrical Bonding Strategies for the Hybrid Integration of Inkjet-Printed Electronics

Rauter

Zikulnig

Sinani

et al. 2020

Electronic Materials

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Different conductive bonding strategies for the hybrid integration of flexible, inkjet-printed electronics are investigated. The focus of the present work lies on providing a practical guide comprising standard techniques that are inexpensive, easily implementable and frequently used. A sample set consisting of identical conductive test structures on different paper and plastic substrates was prepared using silver (Ag) nanoparticle ink. The sintered specimens were electrically contacted using soldering, adhesive bonding and crimping. Electrical and mechanical characterization before and after exposing the samples to harsh environmental conditions was performed to evaluate the reliability of the bonding methods. Resistance measurements were done before and after connecting the specimens. Afterwards, 85 °C/85% damp-heat tests and tensile tests were applied. Adhesive bonding appears to be the most suitable and versatile method, as it shows adequate stability on all specimen substrates, especially after exposure to a 85 °C/85% damp-heat test. During exposure to mechanical tensile testing, adhesive bonding proved to be the most stable, and forces up to 12 N could be exerted until breakage of the connection. As a drawback, adhesive bonding showed the highest increase in electrical resistance among the different bonding strategies.

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“…Results show that experimental displacements of the tip in Z-axis is close to those in simulation results, especially with higher voltages applied. with a high gauge factor (GF) [26], that can transfer applied pressure to strain dependent upon the resistance change property of PEDOT: PSS [13,27,28].…”

Section: Design and Simulation Of Nexusmentioning

confidence: 99%

“…Skin sensor fabrication steps[13] 5.2 Development of PEDOT:PSS solutions for spin coating In this chapter, we report a novel deposition and patterning process for PEDOT:PSS via spin coating and wet lithography employing a simple process that would allow for more cost effective mass production. Traditionally, lift-off is difficult when working with organic materials due to issues with adhesion during pattern definition.Processing often employ methods such as masking with Parylene C, dry development and/or etching.…”

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confidence: 99%

“…Examples of IDE structure made of gold on Kapton Sheet[13] To evaluate the flexible skin sensor, measurements of sheet resistance and resistivity measurements of PEDOT:PSS thin films coated on Kapton were carried out as summarized inTable 5.1. Two PEDOT:PSS solution samples (1:1 and 1:4 ratios of (PEDOT:PSS): Methanol) were spun onto test Kapton Substrates at 2,500 rpm and measured at 5 points using a Lucas Labs 4-Point probe station[13] (shown inFigure 5.3).…”

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Challenges in flexible microsystem manufacturing : fabrication, robotic assembly, control, and packaging.

Wei¹

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Microsystems have been investigated with renewed interest for the last three decades because of the emerging development of microelectromechanical system (MEMS) technology and the advancement of nanotechnology. The applications of microrobots and distributed sensors have the potential to revolutionize micro and nano manufacturing and have other important health applications for drug delivery and minimal invasive surgery. A class of microrobots studied in this thesis, such as the Solid Articulated Four Axis Microrobot (sAFAM) are driven by MEMS actuators, transmissions, and end-effectors realized by 3-Dimensional MEMS assembly. Another class of microrobots studied here, like those competing in the annual IEEE Mobile Microrobot Challenge event (MMC) are untethered and driven by external fields, such as magnetic fields generated by a focused permanent magnet. A third class of microsystems studied in this thesis includes distributed MEMS pressure sensors for robotic skin applications that are manufactured in the cleanroom and packaged in our lab. vi In this thesis, we discuss typical challenges associated with the fabrication, robotic assembly and packaging of these microsystems. For sAFAM we discuss challenges arising from pick and place manipulation under microscopic closed-loop control, as well as bonding and attachment of silicon MEMS microparts. For MMC, we discuss challenges arising from cooperative manipulation of microparts that advance the capabilities of magnetic micro-agents. Custom microrobotic hardware configured and demonstrated during this research (such as the NeXus microassembly station) include micro-positioners, microscopes, and controllers driven via LabVIEW. Finally, we also discuss challenges arising in distributed sensor manufacturing. We describe sensor fabrication steps using clean-room techniques on Kapton flexible substrates, and present results of lamination, interconnection and testing of such sensors are presented. vii TABLE OF CONTENTS

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Fabrication of strain gauge based sensors for tactile skins

Cited by 14 publications

References 18 publications

The Development of Highly Flexible Stretch Sensors for a Robotic Hand

The Development of Highly Flexible Stretch Sensors for a Robotic Hand

Evaluation of Standard Electrical Bonding Strategies for the Hybrid Integration of Inkjet-Printed Electronics

Challenges in flexible microsystem manufacturing : fabrication, robotic assembly, control, and packaging.

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