2009
DOI: 10.1016/j.mee.2008.12.081
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Fabrication of silicon micro-mould for polymer replication using focused ion beam

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Cited by 11 publications
(4 citation statements)
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“…Nanoscale phenomena are influenced by ion beam parameters (ion energy and current), milling parameters (dwell time and beam overlap), and the target material [37]. Many researchers have investigated in process control and planning in order to avoid the defects in FIB milling [45,46]. For further improvements, a novel processing strategy is required to minimize or control the defect.…”
Section: Critical Defects In Integrationmentioning
confidence: 99%
“…Nanoscale phenomena are influenced by ion beam parameters (ion energy and current), milling parameters (dwell time and beam overlap), and the target material [37]. Many researchers have investigated in process control and planning in order to avoid the defects in FIB milling [45,46]. For further improvements, a novel processing strategy is required to minimize or control the defect.…”
Section: Critical Defects In Integrationmentioning
confidence: 99%
“…For circular patterns, a spiral scanning routine can significantly reduce the amount of redeposition. Based on Fu and Hopman's methods, Kim et al [23] chose a continuous slicing method which used spiral scanning as a part of the vector scan instead of using a raster scan to produce accurate circular patterns. Rather than using a discrete slice-by-slice process, the circular structure was fabricated in a contiguous way where the ion beam followed a spiral routine; therefore, stair-step structures on the sidewall were avoided.…”
Section: Determination Of Fabrication Parameters In Fib Machiningmentioning
confidence: 99%
“…Lee et al [17] have developed micro-lens array by hot embossing process using a microstructured anodic aluminum oxide (AAO) mold on polymer and multiscale structure fabricated as an essential component for microoptical applications. Kim et al [18] have reported the fabrication of a microscale hole/mold with circular structure on a silicon substrate. Shin et al [19] have developed 3 × 3 array of micro-holes on the surface of a SiC with optimal experimental conditions with hole diameter of 700 μm and depth of 900 μm.…”
Section: Introductionmentioning
confidence: 99%