Fabrication of package level silicon micro-cooler for electronics cooling

Lau, Boon Long; Han, Yongdian; Gong, Yue; Zhang, Lu; Zhang, Xiaowu

doi:10.1109/eptc.2015.7412309

Cited by 3 publications

(2 citation statements)

References 9 publications

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“…In order to solve the problem of high information integrity validation overhead caused by the cloud memory validation transmission bandwidth when obtaining the validation parameters in the enterprise system architecture (SOA) model, and to improve the reliability of information integrity validation [7], the application of blockchain can effectively carry out the validation traceability, so as to solve the problem of validation fluctuation [8].In this paper, we combine the blockchain technology with the three-stage bookkeeping method, and firstly, through the blockchain platform to determine the accounting information, a smart contract is generated, the integrity verification process needs to be continuously shared in the public chain, so at this time, the accounting information bookkeeping records can be determined, the generated blockchain-based integrity verification confirmation model diagram. The integrity verification confirmation model diagram can effectively determine the accounting information accounting amount fluctuation [9].…”

Section: Constructing Accounting Information Integrity Validation Mod...mentioning

confidence: 99%

Research on Accounting Information Integrity Verification Method based on Blockchain

Zheng

2023

AJMSS

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Conventional accounting information integrity verification method mainly uses SOA mode to obtain verification parameters, which is susceptible to the influence of cloud memory verification transmission bandwidth, resulting in high information integrity verification overhead, therefore, this paper designs a new accounting information integrity verification method based on blockchain. The experimental results show that the designed blockchain-based accounting information integrity verification method has a smaller verification overhead under different data blocks, which proves that the designed accounting information integrity verification method has a better verification effect, has the advantage of low energy consumption, has a certain application value, and makes certain methodological innovations for solving the distortion problem of accounting information.

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Section: Constructing Accounting Information Integrity Validation Mod...mentioning

confidence: 99%

Research on Accounting Information Integrity Verification Method based on Blockchain

Zheng

2023

AJMSS

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“…They were able to achieve a HTC of 34 kW m À2 K À1 at the heat sink with a pressure drop less than 10 kPa. In a similar fashion, Lau et al [13] fabricated a silicon microcooler, the design of which is a combination of spray cooling and microchannel cooling. Sakanova and Yin [14] conducted a computational investigation of cooling using microchannel structures embedded in the backside Cu layer of the DBC.…”

Section: Introductionmentioning

confidence: 99%

Liquid-Cooled Aluminum Silicon Carbide Heat Sinks for Reliable Power Electronics Packages

Pahinkar

Boteler

Ibitayo

et al. 2019

Journal of Electronic Packaging

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With recent advances in the state-of-the-art of power electronic devices, packaging has become one of the critical factors limiting the performance and durability of power electronics. To this end, this study investigates the feasibility of a novel integrated package assembly, which consists of copper circuit layer on an aluminum nitride (AlN) dielectric layer that is bonded to an aluminum silicon carbide (AlSiC) substrate. The entire assembly possesses a low coefficient of thermal expansion (CTE) mismatch which aids in the thermal cycling reliability of the structure. The new assembly can serve as a replacement for the conventionally used direct bonded copper (DBC)—Cu base plate—Al heat sink assembly. While improvements in thermal cycling stability of more than a factor of 18 has been demonstrated, the use of AlSiC can result in increased thermal resistance when compared to thick copper heat spreaders. To address this issue, we demonstrate that the integration of single-phase liquid cooling in the AlSiC layer can result in improved thermal performance, matching that of copper heat spreading layers. This is aided by the use of heat transfer enhancement features built into the AlSiC layer. It is found that, for a given pumping power and through analytical optimization of geometries, microchannels, pin fins, and jets can be designed to yield a heat transfer coefficients (HTCs) of up to 65,000 W m−2 K−1, which can result in competitive device temperatures as Cu-baseplate designs, but with added reliability.

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