1995
DOI: 10.1063/1.113526
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Fabrication of multilayer single-electron tunneling devices

Abstract: A reliable process has been developed for the fabrication of multilevel single-electron tunneling (SET) devices. Using this process, we have fabricated SET devices with Au-SiO-Al and Al-AlOx-SiO-Al overlap capacitors. The SET transistors exhibit voltage gain and, despite the complex device structure, have a low charge noise (7×10−5e/√Hz). Moreover, the use of overlap capacitors in SET devices results in a reduction of cross capacitances down to 8%.

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Cited by 69 publications
(43 citation statements)
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References 5 publications
(5 reference statements)
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“…However, in the devices fabricated with a stacked design the islands are partly [78,79,80] or entirely [79,80] screened from the substrate by an underneath gate or by an underneath counter electrode. Such devices exhibit considerably less noise, down to the lowest value measured so far, 2.5 × 10 −5 e/ √ Hz at 10 Hz [79,80].…”
Section: Background Chargesmentioning
confidence: 99%
“…However, in the devices fabricated with a stacked design the islands are partly [78,79,80] or entirely [79,80] screened from the substrate by an underneath gate or by an underneath counter electrode. Such devices exhibit considerably less noise, down to the lowest value measured so far, 2.5 × 10 −5 e/ √ Hz at 10 Hz [79,80].…”
Section: Background Chargesmentioning
confidence: 99%
“…1(a) using a multilayer process [13]. First, one array was fabricated, together with the two gate electrodes, using standard electron beam lithography and shadowevaporation techniques.…”
Section: (Received 23 May 1996)mentioning
confidence: 99%
“…This technique only allows for production of junctions with capacitance down to Ϸ10 aF implying that operational temperatures need to be in the millikelvin range. Other materials, 7,8 fabrication techniques ͑see Ref. 2 for review also on semiconductor based junctions͒, and structures 9 are being developed.…”
Section: Introductionmentioning
confidence: 99%