Fabrication of Microfluidcs Channel with Bilayer Mo Mask and glass bonding using custom design clamp

J, Niharika; Chauhan, Sandeep Singh; Kumar, Narendra; Dutta, Sushanta; Manhas, S. K.

doi:10.1109/tencon.2019.8929435

Cited by 2 publications

(1 citation statement)

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“…High cost and high diffusing ability of gold masks limit its possible applications. Refractory metals such as molybdenum and chromium are successfully used for deep glass etching [26][27][28][34][35][36] . However, these metals tend to form high-stress layers requiring an advanced deposition process.…”

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confidence: 99%

Deep multilevel wet etching of fused silica glass microstructures in BOE solution

Konstantinova

Andronic

et al. 2023

Sci Rep

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Fused silica glass is a material of choice for micromechanical, microfluidic, and optical devices due to its chemical resistance, optical, electrical, and mechanical performance. Wet etching is the key method for fabricating of such microdevices. Protective mask integrity is a big challenge due extremely aggressive properties of etching solution. Here, we propose multilevel microstructures fabrication route based on fused silica deep etching through a stepped mask. First, we provide an analysis of a fused silica dissolution mechanism in buffered oxide etching (BOE) solution and calculate the main fluoride fractions like $${HF}_{2}^{-}$$ HF 2 - , $${F}^{-}$$ F - , $${(HF)}_{2}$$ ( H F ) 2 as a function of pH and NH4F:HF ratio. Then, we experimentally investigate the influence of BOE composition (1:1–14:1) on the mask resistance, etch rate and profile isotropy during deep etching through a metal/photoresist mask. Finally, we demonstrate a high-quality multilevel over-200 μm etching process with the rate up to 3 μm/min, which could be of a great interest for advanced microdevices with flexure suspensions, inertial masses, microchannels, and through-wafer holes.

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confidence: 99%