2004
DOI: 10.1088/0960-1317/14/5/n01
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Fabrication of microelectrodes for EDM machining by a combined etching process

Abstract: In this note, multi-headed microelectrodes were machined by a combined sequence process of WEDG, ultrasonic-aided chemical etching and an electrochemical anodic etching procedure. Electrodes were cut to 0.1 mm by a wire EDM machine from an original diameter of 3 mm in the first step. Electrodes were continually machined by chemical etching and anodic electrochemical etching. During electrolysis, copper impurity produced on the anode is not easily removed from its matrix. A ultrasonic mechanism was utilized to … Show more

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Cited by 12 publications
(6 citation statements)
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“…The LECD process can be an effective solution for fabricating different complex-shaped electrodes for micro-EDM. Besides the LECD process other fabrication processes are, for example, the reverse EDM process [19], using sacrificial electrode [20], multi-EDM grinding process [21], rapid prototyping [22,23], selective laser sintering [24], a combined sequence process of WEDG, ultrasonic-aided chemical etching and an electrochemical anodic etching procedure [25], etching [26], and conventional material removal processes [27,28]. The above-mentioned processes have some drawbacks and limitations with respect to LECD.…”
Section: Introductionmentioning
confidence: 99%
“…The LECD process can be an effective solution for fabricating different complex-shaped electrodes for micro-EDM. Besides the LECD process other fabrication processes are, for example, the reverse EDM process [19], using sacrificial electrode [20], multi-EDM grinding process [21], rapid prototyping [22,23], selective laser sintering [24], a combined sequence process of WEDG, ultrasonic-aided chemical etching and an electrochemical anodic etching procedure [25], etching [26], and conventional material removal processes [27,28]. The above-mentioned processes have some drawbacks and limitations with respect to LECD.…”
Section: Introductionmentioning
confidence: 99%
“…Copper could be etched by a FeCl 3 or CuCl 2 enchant [4][5][6], and the TiNi foil could also be etched to a thickness of about 10 µm by using a proper volume ratio of HF/HNO 3 /H 2 O etching solution [7]. Although chemical machining (CHM) can be used to machine a Cu metal rod to a small size, the work piece has very high surface roughness [8]. Electrochemical machining (ECM) has many advantages in productivity, efficiency, flexibility and cost effectiveness, and it is well known for the unconventional machining process.…”
Section: Introductionmentioning
confidence: 99%
“…Copper can be etched by FeCl 3 or CuCl 2 enchant [4][5][6], and the thickness of the TiNi foil could be etched to about 10µm by a proper volume ratio of HF/HNO 3 /H 2 O etching solution [7]. Although chemical machining (CHM) can be used to machine a metal rod to a small size, but the surface of the work piece is uneven [8]. Electrochemical machining (ECM) is a well known for the non-traditional machining process.…”
Section: Introductionmentioning
confidence: 99%