Fabrication of Metal-on-Glass High-Pitch Adapters Between VLSI Electronics and Semiconductor Sensors by Laser Ablation

Rey-García, F.; Bao-Varela, Carmen; Fuente, G.F. de la; Gómez-Reino, Carlos; Perez, Eliseo; Rodríguez, P. Baladrón; Gallas, A.; Pazos, A.; Adeva, B.; Alonso, A.; Prieto-Blanco, Xesús

doi:10.1109/jlt.2013.2265271

Cited by 5 publications

(25 citation statements)

References 6 publications

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“…Results were consistent with high quality PA's produced through photolithography [3]. Detectors have been assembled using this pitch adapter design and tested in particle beams at CERN in summer 2011 and 2012 [2].…”

Section: Introductionsupporting

confidence: 66%

“…This new procedure is faster, simpler and cheaper than photolithography for prototyping or low volume production. A metal-on-glass prototype has been successfully manufactured, tested electrically (conductivity, insulation and capacitance), for bondability and metrology [2]. Results were consistent with high quality PA's produced through photolithography [3].…”

Section: Introductionsupporting

confidence: 53%

“…One of the main goals for researchers is focused to pass these negative facts. To solve this problem, customized pieces known as "pitch adaptors" (PA) need to be produced [2].…”

Section: Introductionmentioning

confidence: 99%

“…Generally, at least, one mandatory mask to produce the PA (traces) and another optional one to passivate it, leaving openings for wire bonding, are manufactured. This is thus a slow and expensive method for a prototyping stage [2][3].…”

Section: Introductionmentioning

confidence: 99%

“…In the search for faster and cheaper preparative alternatives, a laser-ablation induced desorption process [4][5], performed on a previously metal-evaporated substrate, has been developed recently in our Laboratories and is described in this work [2]. A number of glass, polymeric (kapton) and silicon materials were explored as substrates for metal deposition, along with different metallization configurations.…”

Section: Introductionmentioning

confidence: 99%

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Fabrication of high-density pitch adapters by laser ablation

Rey-García

Bao-Varela

Perez

et al. 2014

Silicon Photonics and Photonic Integrated Circuits IV

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High Energy Physics experiments make extensive use of micro-strip silicon sensors for tracking purposes. However, the high granularity of the modern detectors makes the connection between the segmented sensor channels and the readout electronics very complex. Enhancing the complexity, a direct connection is not possible in most of the cases due to the mismatch between the detector pad pitch and the electronics. A new method based on laser technology is presented for the fabrication of pitch adapters. In this new method the high-density metal traces are manufactured by means of laser ablation of the metal layer deposited on top of a substrate. Glass, Kapton and Silicon substrates were metal coated and tested for the fabrication of pitch adapters. Finally, a metal-on-glass prototype has been successfully manufactured and tested for electrical conductivity, bondability and metrology. Detectors have been assembled using this pitch adapters design and tested in particle beams at CERN.

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Section: Introductionsupporting

confidence: 66%

Section: Introductionsupporting

confidence: 53%

“…One of the main goals for researchers is focused to pass these negative facts. To solve this problem, customized pieces known as "pitch adaptors" (PA) need to be produced [2].…”

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 3 more Smart Citations

Fabrication of high-density pitch adapters by laser ablation

Rey-García

Bao-Varela

Perez

et al. 2014

Silicon Photonics and Photonic Integrated Circuits IV

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Laser Micromachining and Characterization of Metal-on-Glass High Density Pitch Adapters

Perez

Rey-García

Bao-Varela

et al. 2015

J. Microelectromech. Syst.

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Pitch adapters (PAs) are passive electronic components widely used to adapt different pitches between silicon strip detectors and readout electronics. This paper presents an optimized process to fabricate high-density PAs using laser ablation of metal-on-glass layers. Minimum pitch sizes of 40 µm for the pads and 25 µm for the conductive traces were achieved. The resolution of the method allowed the cutting of traces as narrow as 15 µm. Different prototypes and small production series have been successfully manufactured and tested for electrical parameters, bondability, and metrology. Ageing tests were also performed to ensure long-term reliability. The production yield reached 80%. Fully functional particle detectors for high-energy physics have been assembled using these PAs, characterized and tested with lasers and radioactive sources.[ 2014-0371]Index Terms-High energy physics instrumentation, laser ablation, laser applications, silicon devices, laser materials processing, laser machining.

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