Fabrication of light-turning mirrors in buried-channel silica waveguides for monolithic and hybrid integration

Bazylenko, M.; Gross, M.; Gauja, E.; Chu, P.L.

doi:10.1109/50.552123

Cited by 9 publications

(4 citation statements)

References 11 publications

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“…A number of studies for optical interconnection in the field of next generation Wavelength Division Multiplexing ͑WDM͒ devices, including planar lightwave circuit ͑PLC͒ 5,6 or polymer optical waveguides [7][8][9] have been proposed. However, connecting technologies for the optical components used in these devices require precise mechanical alignment, and this low-yield technology has inhibited the popularization of the WDM system in datacoms applications.…”

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confidence: 99%

Light-induced self-written three-dimensional optical waveguide

Kagami

Yamashita

Itô

2001

Applied Physics Letters

173

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Three-dimensional (3D) optical waveguides were fabricated in a photopolymerizing resin mixture solution by using a multimode optical fiber, without any moving parts. The core portion has formed by the selective photopolymerization of a higher refractive index monomer by Ar+ laser irradiation through the optical fiber. A continuous, straight waveguide was grown by the self-trapping of a guided laser beam. We demonstrated automatic 3D optical circuit formation that enables regrowth after passing through thick transparent glass plates. This growth mechanism also enables automation of the optical interconnection and packaging process, and could potentially contribute to future expansion of optical fiber communications networks.

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confidence: 99%

Light-induced self-written three-dimensional optical waveguide

Kagami

Yamashita

Itô

2001

Applied Physics Letters

173

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“…This technique is also not suitable for high-volume production due to the relatively low speed of FIB milling and the associated high cost. A third technique is based on a metal mirror, at which the desired mirror angle is defined by use of a superficial layer in the wet etching process of the buffer layer [6]. Although the efficiency of these mirrors is very high (up to 95%), the acceptable thermal budget of the fabrication process is low, because the melting temperature of the metal layer used as the mirror is only ~650 °C.…”

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confidence: 99%

Light turning mirrors for hybrid integration of SiON-based optical waveguides and photo-detectors

Çivitçi¹,

Sengo²,

Driessen³

et al. 2013

Opt. Express

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For hybrid integration of an optical chip with an electronic chip containing photo-diodes and processing electronics, light must be coupled from the optical to the electronic chip. This paper presents a method to fabricate quasi-total-internal-reflecting mirrors on an optical chip, placed at an angle of 45° with the chip surface, that enable 90° out-of-plane light coupling between flip-chip bonded chips. The fabrication method utilizes a metal-free, parallel process and is fully compatible with conventional fabrication of optical chips. The mirrors are created using anisotropic etching of 45° facets in a Si substrate, followed by fabrication of the optical structures. After removal of the mirror-defining Si structures by isotropic etching, the obtained interfaces between optical structure and air direct the output from optical waveguides to out-of-plane photo-detectors on the electronic chip, which is aimed to be flip-chip mounted on the optical chip. For transverse-electric (transverse-magnetic) polarization simulations predict a functional loss of 7% (15%), while 7% (18%) is measured.

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“…Introduction: Various approaches have been proposed for realising light-turning mirrors on silica planar lightwave circuits (PLCs) [1][2][3] to achieve planar photodiode integration for PLCs and other devices that need vertical optical coupling with PLCs, such as surface-emitting laser diodes, and optical interconnection between waveguide circuits. One is the formation of an angled structure (e.g.…”

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confidence: 99%

“…The problem with this approach is that it results in a larger footprint (.100 Â 100 mm/mirror), which makes it unsuitable for the high-density integration of mirrors. Another approach involves installing a slope on the substrate or undercladding layer as a front-end process before forming the core layer [3]. This approach requires the metal to be embedded in the silica to provide a mirror surface.…”

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confidence: 99%