Fabrication of large area woodpile structure in polymer

Abstract

A fabrication process of three-dimensional Woodpile photonic crystals based on multilayer photolithography from commercially available photo resist SU8 have been demonstrated. A 6-layer, 2 mm x 2mm woodpile has been fabricated. Different factors that influence the spin thickness on multiple resist application have been studied. The fabrication method used removes, the problem of intermixing, and is more repeatable and robust than the multilayer fabrication techniques for three dimensional photonic crystal structures that have been previously reported. Each layer is developed before next layer photo resist spin, instead of developing the whole structure in the final step as used in multilayer process. The desired thickness for each layer is achieved by the calibration of spin speed and use of different photo resist compositions. Deep UV exposure confinement has been the defining parameter in this process. Layer uniformity for every layer is independent of the previous developed layers and depends on the photo resist planarizing capability, spin parameters and baking conditions. The intermixing problem, which results from the previous layers left uncrossed linked photo resist, is completely removed in this process as the previous layers are fully developed, avoiding any intermixing between the newly spun and previous layers. Also this process gives the freedom to redo every spin any number of times without affecting the previously made structure, which is not possible in other multilayer process where intermediate developing is not performed.