Fabrication of interconnects using pressureless low temperature sintered Ag nanoparticles

Wang, Shuai; Ji, Hongjun; Li, Mingyu; Wang, Chunqing

doi:10.1016/j.matlet.2012.06.089

Cited by 80 publications

(26 citation statements)

References 14 publications

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“…4a. When the paste is sintered at 200 °C for 20 min, after the thinning process, the thermal conductivity shows a remarkable increase for 3 times compared with that of thick organic shells (74 W/m·K) in previous work [7], as high as 229 W/m·K with porosity of 27%. The value is higher than the half of the thermal conductivity of bulk Ag (410 W/m·K) and 4.5 times higher than that of Sn-Pb solders (51 W/m·K).…”

Section: Resultsmentioning

confidence: 75%

“…Recently, various studies on sintering of Ag nanoparticles paste for bonding have been reported [1][2][3][4][5][6][7][8][9]. However, the application of Ag nanoparticles paste is still restricted by long sintering time which is about 20-30 min [1,[3][4][5][6][7] and high sintering temperature which is normally above 250 °C [1][2][3][4][5][6].…”

Section: Introductionmentioning

confidence: 99%

“…However, the application of Ag nanoparticles paste is still restricted by long sintering time which is about 20-30 min [1,[3][4][5][6][7] and high sintering temperature which is normally above 250 °C [1][2][3][4][5][6]. These two sintering parameters are unbearable for polymeric substrates and electronic components based on organic groups.…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Twin-induced ultra-high thermal conductivity of sintering Ag nanoparticles for high power density electronic packaging

Wang¹,

Li²,

Kim³

2014

2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction M

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Rapid pressureless low temperature sintering of Ag nanoparticles for bonding is achieved. Organic shells adsorbing on the surface of Ag nanoparticles to stabilize them are thinned to be a sparse protecting layer. Numerous coherent twin boundaries formed in sintered Ag nanoparticles with a grain size of 21 nm induce ultra-high thermal conductivity (229 W/m·K), which overcomes the intrinsic defect that metals with nano-sized grain generally cause a pronounced decrease in thermal conductivity because of the grain boundary scattering effect.

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Section: Resultsmentioning

confidence: 75%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Twin-induced ultra-high thermal conductivity of sintering Ag nanoparticles for high power density electronic packaging

Wang¹,

Li²,

Kim³

2014

2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction M

Self Cite

View full text Add to dashboard Cite

show abstract

“…However, a minimum pressure-the ''threshold stress''-must be exceeded to form a reliable sintered Ag joint. It should be noted here that it is not necessary to completely remove the capping agent for bonding to be effective, 28,32,33 but leaving the organic residues in the sintered Ag joint will pose a risk to long-term reliability.…”

Section: ''Pressure'' Micron-ag Pastementioning

confidence: 99%

Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?

Siow

2014

Journal of Elec Materi

269

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Silver (Ag) has been under development for use as interconnect material for power electronics packaging since the late 1980s. Despite its long development history, high thermal and electrical conductivities, and lead-free composition, sintered Ag technology has limited market penetration. This review sets out to explore what is required to make this technology more viable. This review also covers the origin of sintered Ag, the different types and application methods of sintered Ag pastes and laminates, and the long-term reliability of sintered Ag joints. Sintered Ag pastes are classified according to whether pressure is required for sintering and further classified according to their filler sizes. This review discusses the main methods of applying Ag pastes/laminates as dieattach materials and the related processing conditions. The long-term reliability of sintered Ag joints depends on the density of the sintered joint, selection of metallization or plating schemes, types of substrates, substrate roughness, formulation of Ag pastes/laminates, joint configurations (i.e., joint thicknesses and die sizes), and testing conditions. This paper identifies four challenges that must be overcome for the proliferation of sintered Ag technology: changes in materials formulation, the successful navigation of the complex patent landscape, the availability of production and inspection equipment, and the health concerns of Ag nanoparticles. This paper is expected to be useful to materials suppliers and semiconductor companies that are considering this technology for their future packages.

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“…On the other hand, although sintering could be realized at considerably low temperature, application of nano Ag particles was limited due to the relatively high cost [4]- [6]. Sub-micro Ag particles, which combined the easily sintering ability and relatively low cost, called the attention of researchers [7].…”

Section: Introductionmentioning

confidence: 99%

Nano-SiC added Ag paste sintering die-attach for SiC power devices

Zhang

Nagao

Park

et al. 2014

Proceedings of the 5th Electronics System-Integration Technology Conference (ESTC)

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Low temperature and low pressure sintering Ag paste composed by sub-micro Ag particle and organic solvent was presented. The apparent improvement of bonding strength was realized by adding small amount of nano thickness Ag flake. Optimum proportion of sub-micro particle and nano thickness flake was determined. NanoSiC particles were added into the optimized paste for sake of the possibility of properties advancement. The electrical property of newly developed Ag paste was measured by an improved test method. SiC die attachment and DBC (Direct Bonding Cu) substrate was conducted to test the practical application prospect of newly developed Nano-SiC added Ag paste.

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Fabrication of interconnects using pressureless low temperature sintered Ag nanoparticles

Cited by 80 publications

References 14 publications

Twin-induced ultra-high thermal conductivity of sintering Ag nanoparticles for high power density electronic packaging

Twin-induced ultra-high thermal conductivity of sintering Ag nanoparticles for high power density electronic packaging

Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?

Nano-SiC added Ag paste sintering die-attach for SiC power devices

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