Fabrication of high melting point joint using Sn-57Bi-1Ag low temperature lead-free solder and gold-plated electrode

Maruya, Yuki; Hata, Hanae; Shohji, Ikuo; Koyama, Satoshi

doi:10.23919/icep.2017.7939445

Cited by 4 publications

(4 citation statements)

References 11 publications

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“…The growing trend of miniaturization of electric components precludes the use of heat sensitive materials that could deteriorate on exposure to high temperatures. Low energy consumption during soldering and suppressed loaded thermal stress of the solder joint are required of low melting temperature solder applications (Maruya et al , 2017; Zhang et al , 2017). The good creep resistance, and high tensile and joint strength properties of Sn-Bi contributes toward shelf life of solder joints.…”

Section: Introductionmentioning

confidence: 99%

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Effects of alloying element on mechanical properties of Sn-Bi solder alloys: a review

Kamaruzzaman

Goh

2022

SSMT

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Purpose This paper aims to review recent reports on mechanical properties of Sn-Bi and Sn-Bi-X solders (where X is an additional alloying element), in terms of the tensile properties, hardness and shear strength. Then, the effects of alloying in Sn-Bi solder are compared in terms of the discussed mechanical properties. The fracture morphologies of tensile shear tested solders are also reviewed to correlate the microstructural changes with mechanical properties of Sn-Bi-X solder alloys. Design/methodology/approach A brief introduction on Sn-Bi solder and reasons to enhance the mechanical properties of Sn-Bi solder. The latest reports on Sn-Bi and Sn-Bi-X solders are combined in the form of tables and figures for each section. The presented data are discussed by comparing the testing method, technical setup, specimen dimension and alloying element weight percentage, which affect the mechanical properties of Sn-Bi solder. Findings The addition of alloying elements could enhance the tensile properties, hardness and/or shear strength of Sn-Bi solder for low-temperature solder application. Different weight percentage alloying elements affect differently on Sn-Bi solder mechanical properties. Originality/value This paper provides a compilation of latest report on tensile properties, hardness, shear strength and deformation of Sn-Bi and Sn-Bi-X solders and the latest trends and in-depth understanding of the effect of alloying elements in Sn-Bi solder mechanical properties.

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Section: Introductionmentioning

confidence: 99%

“…However, Sn-Bi solder alloys have some drawbacks. They have poor ductility when high strain rates are applied at low temperatures (Maruya et al , 2017). This implies that Sn-Bi is highly dependent on the strain rate applied (Chen et al , 2016).…”

Section: Introductionmentioning

confidence: 99%

Effects of alloying element on mechanical properties of Sn-Bi solder alloys: a review

Kamaruzzaman

Goh

2022

SSMT

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“…Very recently, Maruya et al [9] investigated samples combining Sn-Bi-Ag alloys and gold fabricated by electroplating that are expected to be a good candidate for low-temperature lead-free soldering. However, this approach has shown several drawbacks, such as being time-consuming and requiring sophisticated processing, as it involves multiple fabrication steps at different temperatures ramping.…”

Section: Introductionmentioning

confidence: 99%

“…However, this approach has shown several drawbacks, such as being time-consuming and requiring sophisticated processing, as it involves multiple fabrication steps at different temperatures ramping. Besides, current low melting temperature solders face several key challenges, which include more intermetallic compound formation (thus becoming more brittle), high cost associated with the addition of supplementary elements to decrease the melting point temperature, and an increase in the possibility of thermal or popcorn cracking (reliability problems) [9].…”

Section: Introductionmentioning

confidence: 99%

Microstructural studies of ultrarapidly quenched foils of zinc-doped indium–tin eutectic alloys

et al. 2018

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Alloys with the composition of Sn (46.5 at.%)-In (50.7 at.%)-Zn (2.8 at.%) were fabricated by using the ultrarapid quenching process, with quenching rate up to 10 5 K/s. These materials were obtained in the shape of foils with a thickness varying from 30 to 70 lm. Their phase composition, microstructure, grain structure, and texture have been analyzed and revealed that these alloys consist of solid solutions based on the b phase (In 3 Sn) and c phase (InSn 4) with inclusions of zinc. Aging processes in the foils revealed that the volume fraction of zinc (V Zn) increases with the increase in the samples exposure time to the air at room temperature. The electron backscatter diffraction analysis has shown that these foils have a microcrystalline structure. The mechanism of the texture formation in these materials has been explained.

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Microstructure and tensile properties of Sn–Bi–Co solder alloy

Kamaruzzaman

Goh

2023

J Mater Sci: Mater Electron

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Fabrication of high melting point joint using Sn-57Bi-1Ag low temperature lead-free solder and gold-plated electrode

Cited by 4 publications

References 11 publications

Effects of alloying element on mechanical properties of Sn-Bi solder alloys: a review

Effects of alloying element on mechanical properties of Sn-Bi solder alloys: a review

Microstructural studies of ultrarapidly quenched foils of zinc-doped indium–tin eutectic alloys

Microstructure and tensile properties of Sn–Bi–Co solder alloy

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