2009
DOI: 10.1557/proc-1228-kk12-10
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Fabrication of Ga-templates Using a Focused Ion Beam

Abstract: There are many factors that have the potential to limit significant advances in device technology. These include the ability to arrange materials at shrinking dimensions and the ability to successfully integrate new materials with better properties or new functionalities. To overcome these limitations, the development of advanced processing methods that can organize various combinations of materials at nano-scale dimensions with the necessary quality and reliability is required. We have explored using a galliu… Show more

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“…This value depends on the ion beam current used and milling time. The patterned samples were ultrasonically cleaned in acetone and IPA before being loaded into a vacuum chamber with a base pressure of 9 × 10 −10 Torr and annealed at 600 • C for 1 h. This annealing time and temperature was chosen based on previous reports found in the literature of Ga droplet formation on SiO 2 and our previous experiments on thin amorphous Si membranes [5].…”
Section: Methodsmentioning
confidence: 99%
“…This value depends on the ion beam current used and milling time. The patterned samples were ultrasonically cleaned in acetone and IPA before being loaded into a vacuum chamber with a base pressure of 9 × 10 −10 Torr and annealed at 600 • C for 1 h. This annealing time and temperature was chosen based on previous reports found in the literature of Ga droplet formation on SiO 2 and our previous experiments on thin amorphous Si membranes [5].…”
Section: Methodsmentioning
confidence: 99%