2020
DOI: 10.1016/j.msea.2020.138979
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Fabrication of Cu–Ni–Si alloy by melt spinning and its mechanical and electrical properties

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Cited by 11 publications
(5 citation statements)
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“…Taking into consideration the density results, there is no difference in terms of the alloy additive used, and the density decreases linearly from 8.32 to 7.82 g/cm 3 as the Mg content increases. In comparison, the density of the CuNiSi alloy is 8.8 g/cm 3 [20][21][22], the density of the CuZn37 alloy (typical brass) is 8.44 g/cm 3 [16], and the density of pure copper is 8.96 g/cm 3 [2,3]. This shows that the CuMg alloys may function as a much lighter conducting material than commercially used alloys.…”
Section: Physical Propertiesmentioning
confidence: 94%
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“…Taking into consideration the density results, there is no difference in terms of the alloy additive used, and the density decreases linearly from 8.32 to 7.82 g/cm 3 as the Mg content increases. In comparison, the density of the CuNiSi alloy is 8.8 g/cm 3 [20][21][22], the density of the CuZn37 alloy (typical brass) is 8.44 g/cm 3 [16], and the density of pure copper is 8.96 g/cm 3 [2,3]. This shows that the CuMg alloys may function as a much lighter conducting material than commercially used alloys.…”
Section: Physical Propertiesmentioning
confidence: 94%
“…According to Nordheim's rule [44], when an alloy additive having atoms with a different diameter is introduced into the metallic matrix, the electrical conductivity must decrease. Thus, the electrical conductivity is approximately half that of pure copper; however, it is at the same level as that of CuNiSi alloy, and Mg has a much lower cost than Ni [20][21][22] and a much higher cost than CuZn37 alloy (typical brass) [16]. Taking into consideration the density results, there is no difference in terms of the alloy additive used, and the density decreases linearly from 8.32 to 7.82 g/cm 3 as the Mg content increases.…”
Section: Physical Propertiesmentioning
confidence: 99%
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“…As a consequence, the materials used for preparing a copper alloy lead frame, which is one of the most important components of an integrated circuit, need to have excellent performance, such as high strength, high electrical conductivity, good workability, and so on [1]. Hence, numerous works have been conducted to explore Cu-based alloys with a good combination of high strength and electrical conductivity [2][3][4][5][6][7][8][9]. However, exploring the excellent materials is not only beneficial for the preparation of a lead frame, but is also a cheap method for obtaining very thin alloy sheets, where the thickness of the lead frame is always about 0.1 mm [1,10].…”
Section: Introductionmentioning
confidence: 99%