Fabrication of ballpoint-ink via encapsulating inorganic pigments in microemulsion gels

Abstract

The way to fabricate ballpoint ink from microemulsions gel.

Parametric study on conductive patterns by low-temperature sintering of micron silver ink

“…Nowadays, traditional rigid circuit boards cannot meet the demand for electronic devices that focus on being both lightweight and foldable. 1,2 Accordingly, fabrication of conductive patterns on flexible substrates, e.g. , polyimide 3,4 and paper, 5–7 has attracted much attention, with the process roughly proceeding via two consecutive steps, i.e.…”

“…Nowadays, traditional rigid circuit boards cannot meet the demand for electronic devices that focus on being both lightweight and foldable. 1,2 Accordingly, fabrication of conductive patterns on exible substrates, e.g., polyimide 3,4 and paper, [5][6][7] has attracted much attention, with the process roughly proceeding via two consecutive steps, i.e., the deposition of electrical/conductive materials and subsequent conversion of printed patterns into conductive components. Conductive ink is the core material and plays an important role in determining the performance and quality of the conductive patterns, such as electrical resistivity and reliability.…”