Fabrication of 45-Degree Integrated Mirrors for Three-Dimensional Board-Level Optical Interconnects Realizing Efficient Light Coupling

Liu, Xiaofeng; Miao, Hua; Wang, Guodong; Yao, Tengfei; Liu, Jianhui; Sun, Rong

doi:10.1109/icept59018.2023.10492032

2023 24th International Conference on Electronic Packaging Technology (ICEPT) 2023

DOI: 10.1109/icept59018.2023.10492032

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Fabrication of 45-Degree Integrated Mirrors for Three-Dimensional Board-Level Optical Interconnects Realizing Efficient Light Coupling

Xiaofeng Liu,

Hua Miao,

Guodong Wang

et al.

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Fabrication of 45-Degree Integrated Mirrors for Three-Dimensional Board-Level Optical Interconnects Realizing Efficient Light Coupling

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