2010
DOI: 10.1063/1.3326320
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Fabrication of 3-μm diameter pin hole array (PHA) on thick W substrates

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Cited by 3 publications
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“…In [8] the authors used a laserbeam machined tungsten disk of 200 µm thickness, 20 µm diameter holes and separated by 250 µm in both dimensions. In [9] 3 µm hole size spaced by 50 µm have been produced. The limit of having such small holes and so closed displaced is in the number of the charges that can go through (so in the Signal to Noise Ratio) and in the possible overlap (to avoid!)…”
Section: Emittance For Space Charge Dominated Beamsmentioning
confidence: 99%
“…In [8] the authors used a laserbeam machined tungsten disk of 200 µm thickness, 20 µm diameter holes and separated by 250 µm in both dimensions. In [9] 3 µm hole size spaced by 50 µm have been produced. The limit of having such small holes and so closed displaced is in the number of the charges that can go through (so in the Signal to Noise Ratio) and in the possible overlap (to avoid!)…”
Section: Emittance For Space Charge Dominated Beamsmentioning
confidence: 99%