Fabrication of 25 μ m-filter microfluidic chip on silicon substrate

Abstract

This paper presents the entire fabrication process including photolithography, sputtering, deep reactive ion etching (Bosch DRIE process) on silicon substrate and bonding process between the lid and silicon substrate to create a designed filtration microfluidic chip with dimension of 28 mm × 7 mm, one inlet port and one outlet port. A pattered silver thin film was deposited on a silicon sample by the lift-off method. Subsequently the newly fabricated sample was anisotropically etched by Bosch DRIE process. Some parameters of Bosch DRIE process such as bias power, duration of etching step and passivation step, oxygen presence were studied to explore the dependence of silicon channel depth and etched shape profile on these parameters. An optimized process was utilized to fabricate a featured silicon channel with vertical, smooth sidewalls and an overall good uniformity. The silicon channel has four arrays of microposts with various distances between microposts from 25 μm to 100 μm. The depth of the silicon channel was about 150 μm. After that, silicon substrate was bonded with mica lid by adhesive bonding method to form the completed filtration microfluidic chip. The samples were characterized by scanning electron microscopy (SEM), mechanical profilometer (DEKTAK 6 M), optical microscopy (Olympus MX51). In this paper a test was performed to demonstrate how the microfluidic chip works by pumping solution with many various sizes of particles through the inlet port of the microfluidic chip and obtaining a solution with desired particles sizes (smaller than 25 μm) through another port. Moreover, the chip could be pumped de-ionized water through outlet port for backwash in order to make this microfluidic chip reusable. Finally, a few applications of microfluidic chips are presented to illustrate the advantages of this technology and the potential for future development.

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Fabrication of Three-Dimensionally Deformable Metal Structures Using Precision Electroforming

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