Fabrication method of lab-on-PCB devices using a microheater with a thermo-mechanical barrier

Franco, Emilio; Salvador, Blas; Perdigones, Francisco; Cabello, Miguel; Quero, J.M.

doi:10.1016/j.mee.2018.02.019

Cited by 7 publications

(5 citation statements)

References 33 publications

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“…42 Also, copper lines act as mechanical barrier against reow of the solvated PMMA. 40 As the nal conclusion, based on various investigations on the affecting parameters, the best method for bonding PMMA and PCB was derived with following conditions: the solvent is analytical grade chloroform; the interface is concentric rectangular copper rings on the PCB; the pressure is moderate and applied by hand; the device is made at room temperature.…”

Section: Bonding Processmentioning

confidence: 99%

“…Franco et al has proposed a thermal bonding method for the direct attachment of PCB to PMMA. 40 In this method bonding area is heated up to near the transition temperature of PMMA and a moderate pressure is applied. 41 While gas-phase microuidic devices are similar to liquidphase microuidic devices, special fabrication challenges are encountered in gas phase.…”

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Development of a direct PMMA-PCB bonding method for low cost and rapid prototyping of microfluidic-based gas analysers

Emadzadeh,

Ghafarinia

2024

RSC Adv.

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Section: Bonding Processmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Development of a direct PMMA-PCB bonding method for low cost and rapid prototyping of microfluidic-based gas analysers

Emadzadeh,

Ghafarinia

2024

RSC Adv.

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“…Therefore, the copper layer is patterned to fabricate copper lines for heat dissipation. These heaters were integrated in both rigid [ 24 , 25 , 26 , 27 , 28 ] and flexible [ 29 , 30 , 31 ] substrates for deoxyribonucleic acid (DNA) amplification. The temperature should be as uniform as possible in the area of the reaction chamber.…”

Section: Printed Circuit Boards For Electronics Sensors and Actuatorsmentioning

confidence: 99%

Printed Circuit Boards: The Layers’ Functions for Electronic and Biomedical Engineering

Perdigones

Quero

2022

Micromachines

Self Cite

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This paper describes the fabrication opportunities that Printed Circuit Boards (PCBs) offer for electronic and biomedical engineering. Historically, PCB substrates have been used to support the components of the electronic devices, linking them using copper lines, and providing input and output pads to connect the rest of the system. In addition, this kind of substrate is an emerging material for biomedical engineering thanks to its many interesting characteristics, such as its commercial availability at a low cost with very good tolerance and versatility, due to its multilayer characteristics; that is, the possibility of using several metals and substrate layers. The alternative uses of copper, gold, Flame Retardant 4 (FR4) and silver layers, together with the use of vias, solder masks and a rigid and flexible substrate, are noted. Among other uses, these characteristics have been using to develop many sensors, biosensors and actuators, and PCB-based lab-on chips; for example, deoxyribonucleic acid (DNA) amplification devices for Polymerase Chain Reaction (PCR). In addition, several applications of these devices are going to be noted in this paper, and two tables summarizing the layers’ functions are included in the discussion: the first one for metallic layers, and the second one for the vias, solder mask, flexible and rigid substrate functions.

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“…The feasibility of this method was demonstrated by the successful fabrication of a thick-film substrate comprising COC and its pairing with PMMA. This bonding strategy could also be used with other thermoplastics, as evidenced by the work of Franco et al [82], who used a controlled thermal method to successfully bond the PMMA with FR-4. Wet etching was applied to print the microheater circuit on the copper side of the FR-4, and then the PCB was integrated onto the micromilled PMMA.…”

Section: Thermal Bondingmentioning

confidence: 99%

Irreversible bonding techniques for the fabrication of a leakage-free printed circuit board-based lab-on-chip in microfluidic platforms—a review

Ali@Hasim

Ahaitouf

Abdullah

2021

Meas. Sci. Technol.

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Lab-on-chip (LOC) is recognised as one of the most affordable solutions for integrating electronics and fluidics devices. In this field, bonding plays a vital role because it provides the means for attaching multiple components onto a substrate, transforming them into a microfluidic circuit. Bonding is an integral step, especially when designing a device that is free from leakage and eventual clogging. A comprehensive review of the latest irreversible bonding technologies is discussed in this paper, in which the focus is on the layered microfluidic systems with large sensor arrays. This review covers microfluidic devices fabricated from a rigid-type glass–fibre-printed circuit board and a thermoplastic flexible printed circuit with 186 references whose development date back three decades ago. The bonding techniques are organised into the following four groups: (a) adhesive bonding, (b) thermal and solvent bonding, (c) surface modification and dry bonding and (d) photoresist groups. Other techniques are available beyond these groupings, but they can be classified into the nearest group to facilitate the discussion. This paper will benefit researchers and practitioners aiming to develop polymer-based LOC devices.

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Fabrication method of lab-on-PCB devices using a microheater with a thermo-mechanical barrier

Cited by 7 publications

References 33 publications

Development of a direct PMMA-PCB bonding method for low cost and rapid prototyping of microfluidic-based gas analysers

Development of a direct PMMA-PCB bonding method for low cost and rapid prototyping of microfluidic-based gas analysers

Printed Circuit Boards: The Layers’ Functions for Electronic and Biomedical Engineering

Irreversible bonding techniques for the fabrication of a leakage-free printed circuit board-based lab-on-chip in microfluidic platforms—a review

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