“…In addition to etching, through-holes in glass wafers can be made by drilling and powder blasting (Belloy, Sayah, & Gijs, 2000). In general, glass-glass bonding is considered easier than silicon-silicon or polymer-polymer bonding because of the wide variety of methods available for glass (Chiem et al, 2000;Daridon et al, 2001;Jia, Fang, & Fang, 2004;Easley, Humphrey, & Landers, 2007;Tiggelaar et al, 2007). Silicon-glass anodic bonding is also a routine task (Despont et al, 1996;Berthold et al, 2000;Lee et al, 2000).…”