Fabrication and thermal performance of porous crack composite wick flattened heat pipe

Jiang, Lelun; Huang, Yong; Tang, Yong; Li, Yan; Zhou, Wei; Jiang, Lin-zhen; Gao, Jinwu

doi:10.1016/j.applthermaleng.2014.01.034

“…Tang et al [28], in 2018, presented a throughout review, concentrated in ultra-thin micro heat pipe technology (including vapor chamber and loop heat pipes) for electronic cooling. The authors listed the several wick structures used in these devices: sintered metallic powder, microgrooves, made by spin-forming process (Jiang et al [29]), ploughing extrusion process (Zeng et al, [30]), electrodischarge machining (Das et al, [31]), plasma etching and lase micromachinig (Lim et al [32]) and hybrid (combination of sintered and microgooves). Zhou et al [33], in 2023, presented a similar review paper for ultra-thin vapor chambers, where, among several aspects, several different technologies of porous media (wick structures) were mentioned and compared.…”

Section: Mini Heat Pipesmentioning

confidence: 99%

Experimental study of multidimensional wire-plate/sintered hybrid mini heat pipes for electronics

Mantelli,

Batista,

Mera

2024

Heat Mass Transfer

0

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The experimental study concerning new two and three dimensional mini heat pipes, proposed for cooling electronic components in printed circuit boards is presented. These heat pipes can capture the heat from electronic components and conduct it to the cabinet wall, through the narrow spaces available between boards. As the location and dissipation of the electronic components vary, several different heat pipes are necessary for a complex electronic equipment, which should operate at different temperatures and orientations. A hybrid wick structure, composed by sintered copper powder and wire-plate technologies along the device are proposed. Four different types of hybrid mini heat pipes, in up to three generations, were designed and constructed, using diffusion bonding fabrication technique. Two different testing setups were developed. First, the thermal performance of the hybrid heat pipes was accessed, resulting in the selection of the appropriated working fluid and its volume. Second, the devices were tested in rigs that mimic actual electronic equipment geometries and operational conditions. The several hybrid multidimensional heat types worked well, even against gravity. Besides, the present work shows that the wire-plate wick structure, up to this date considered only in academic studies, resulted in very flexible heat pipes, able to start up easily, in several adverse geometric and gravitational conditions, especially when combined with more conventional technologies, such as sintered porous media. Besides, the fabrication process developed that includes diffusion bonding, can be considered a novelty.

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“…Tang et al [28], in 2018, presented a throughout review, concentrated in ultra-thin micro heat pipe technology (including vapor chamber and loop heat pipes) for electronic cooling. The authors listed the several wick structures used in these devices: sintered metallic powder, microgrooves, made by spin-forming process (Jiang et al [29]), ploughing extrusion process (Zeng et al, [30]), electrodischarge machining (Das et al, [31]), plasma etching and lase micromachinig (Lim et al [32]) and hybrid (combination of sintered and microgooves). Zhou et al [33], in 2023, presented a similar review paper for ultra-thin vapor chambers, where, among several aspects, several different technologies of porous media (wick structures) were mentioned and compared.…”

Section: Mini Heat Pipesmentioning

confidence: 99%

Experimental Study of Multidimensional Wire-plate/sintered Hybrid Mini Heat Pipes for Electronics

Mantelli,

Batista,

Mera

2023

Preprint

0

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The experimental study concerning new two and three dimensional mini heat pipes, proposed for cooling electronic components in printed circuit boards is presented. These heat pipes can capture the heat from electronic components and conduct it to the cabinet wall, through the narrow spaces available between boards. As the location and dissipation of the electronic components vary, several different heat pipes are necessary for a complex electronic equipment, which should operate at different temperatures and orientations. A hybrid wick structure, composed by sintered copper powder and wire-plate technologies along the device are proposed. Four different types of hybrid mini heat pipes, in up to three generations, were designed and constructed, using diffusion bonding fabrication technique. Two different testing setups were developed. First, the thermal performance of the hybrid heat pipes was accessed, resulting in the selection of the appropriated working fluid and its volume. Second, the devices were tested in rigs that mimic actual electronic equipment geometries and operational conditions. The several hybrid multidimensional heat types worked well, even against gravity. Besides, the present work shows that the wire-plate wick structure, up to this date considered only in academic studies, resulted in very flexible heat pipes, able to start up easily, in several adverse geometric and gravitational conditions, especially when combined with more conventional technologies, such as sintered porous media. Besides, the fabrication process developed that includes diffusion bonding, can be considered a novelty.

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“…化、超薄化方向的不断突破, 也使其成为解决当前电子设备在狭小空间内高热流密度散热问题的理想方案 [3] . 目前, 超薄热管已广泛应用于微小型电子器件的散热中, 如智能手机、平板电脑、智能手表、便携式投影仪等 [4] [5,6] 、编织丝网 [7,8] 、各种截面形状的沟槽吸液芯结构 [9,10] 和由两种或多种单一结构组合成的复合吸液芯结构 [11,12] . 吸液芯结构是热管 Aoki等人 [15] 以铜丝网为吸液芯结构制备了厚度分别为 0.7和1 mm的两款长度分别为100和150 mm的超薄热管, 实验测试其最大传热量分别可达到7和20 W. Singh 等人 [16] 以铜纤维作为吸液芯结构开发了一款用于解决高热流密度电子散热的压扁型超薄热管.…”

Section: 极高的导热性和优良的等温性而热管技术在微小unclassified

Experimental research on structure parameters of the ultra-thin flattened heat pipe

Tang¹,

Dai²,

Liu³

et al. 2019

Chin. Sci. Bull.

0

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Fabrication and thermal performance of porous crack composite wick flattened heat pipe

Cited by 27 publications

References 18 publications

Experimental study of multidimensional wire-plate/sintered hybrid mini heat pipes for electronics

Experimental study of multidimensional wire-plate/sintered hybrid mini heat pipes for electronics

Experimental Study of Multidimensional Wire-plate/sintered Hybrid Mini Heat Pipes for Electronics

Experimental research on structure parameters of the ultra-thin flattened heat pipe

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