Abstract:We have developed a new microshutter array (MSA) subassembly. The MSA and a silicon substrate are flip-bonded together. The MSA has a new back side fabrication process to actuate the microshutters electrostatically, and the new silicon substrate has light shields. The microshutters with a pixel size of 100 x 200 µm 2 are fabricated on silicon with thin silicon nitride membranes. The microshutters rotate 90 o on torsion bars. The selected microshutters are actuated, held, and addressed electrostatically by appl… Show more
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