2006
DOI: 10.1088/0957-4484/17/6/019
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Fabrication and magnetotransport properties of ordered sub-100 nm pseudo-spin-valve element arrays

Abstract: We prepared ordered sub-100 nm pseudo-spin-valve (PSV) element arrays by electrodeposition of NiFe/Cu/Co into the pores of self-organized nanoporous anodized aluminium templates. Field-emission scanning electron microscopy reveals that the sub-100 nm PSV arrays, of uniform size, are well separated and exhibit a perfect two-dimensional array with a hexagonal pattern. The easy-axis hysteresis loops show two distinct steps related to the separate reversal of soft (NiFe) and hard (Co) layers. The switching fields … Show more

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Cited by 11 publications
(13 citation statements)
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“…Their third samples were EBSVs of the form FeMn(10)/Py(5)/Co(2)/Cu(2)/Co(2)/Py(10)/Cu(2 0), with the thin Co layers added to improve thermal stability. The hysteresis curve for an EBSV with t Cu = 2 nm [143], or for a hybrid SV with t Cu = 4 nm [144], each looked as expected for an uncoupled SV. However, the variations of the CPP-MRs with t Cu in [143] and [144] differ from expectations in opposite ways.…”
Section: Multiple Bathsmentioning
confidence: 94%
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“…Their third samples were EBSVs of the form FeMn(10)/Py(5)/Co(2)/Cu(2)/Co(2)/Py(10)/Cu(2 0), with the thin Co layers added to improve thermal stability. The hysteresis curve for an EBSV with t Cu = 2 nm [143], or for a hybrid SV with t Cu = 4 nm [144], each looked as expected for an uncoupled SV. However, the variations of the CPP-MRs with t Cu in [143] and [144] differ from expectations in opposite ways.…”
Section: Multiple Bathsmentioning
confidence: 94%
“…In 2006, Wang and co-workers published three papers [143][144][145] on multiple bath electrodeposition into anodized alumina templates, using a separate bath for each of three or four components. As seed layers and bottom contacts they sputtered onto the template either 50 nm of Ta [143,145] or 100 nm of Au [144].…”
Section: Multiple Bathsmentioning
confidence: 99%
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“…Typical methods for the fabrication of nanostructures include methods like photolithography [16], e-beam lithography [17], and focused ion beam lithography [18]. Even though these methods offer high-quality nanostructures, they involve tedious procedures, long processing time, limited scalability, and high cost.…”
Section: Introductionmentioning
confidence: 99%
“…Nevertheless, the success of such fabrication depends not only on nanofabrication techniques, but also on approaches that offer low‐cost operation and high throughput, suitable for mass production. So far, most of the published works rely on lithography‐based processes such as photolithography, focused‐ion beam lithography, and deep‐UV lithography . The disadvantages of these approaches include long processing time, complicated procedures, high cost, and limited scalability.…”
Section: Introductionmentioning
confidence: 99%