Fabrication and interfacial reaction of carbon nanotube-embedded Sn–3.5Ag solder balls for ball grid arrays

Ko, Young-Ki; Kwon, Sang-Hyun; Lee, Young-Kyu; Kim, Junki; Lee, Chang-Woo; Yoo, Sehoon

doi:10.1016/j.jallcom.2013.08.052

Cited by 13 publications

(3 citation statements)

References 31 publications

(28 reference statements)

Supporting

Mentioning

Contrasting

Order By: Relevance

“…However, in the work of Ko et al [117], the efficiency of the suppression effect in the as-soldered and thermally aged joints was very much improved when the authors implemented a new composite solder fabrication method which is called surface impact mixing (SIM). Solder balls were used in this work instead of solder paste.…”

Section: Effect Of Nanoparticle Addition On Sac–x/cu Joint Interfacementioning

confidence: 99%

Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions

Tan

Yusof

2015

Science and Technology of Advanced Materials

View full text Add to dashboard Cite

Nanocomposite lead-free solders are gaining prominence as replacements for conventional lead-free solders such as Sn–Ag–Cu solder in the electronic packaging industry. They are fabricated by adding nanoparticles such as metallic and ceramic particles into conventional lead-free solder. It is reported that the addition of such nanoparticles could strengthen the solder matrix, refine the intermetallic compounds (IMCs) formed and suppress the growth of IMCs when the joint is subjected to different thermal conditions such as thermal aging and thermal cycling. In this paper, we first review the fundamental studies on the formation and growth of IMCs in lead-free solder joints. Subsequently, we discuss the effect of the addition of nanoparticles on IMC formation and their growth under several thermal conditions. Finally, an outlook on the future growth of research in the fabrication of nanocomposite solder is provided.

show abstract

Section: Effect Of Nanoparticle Addition On Sac–x/cu Joint Interfacementioning

confidence: 99%

Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions

Tan

Yusof

2015

Science and Technology of Advanced Materials

View full text Add to dashboard Cite

show abstract

“…Ko et al found that the IMC thickness formation of the CNT-SnAg solder was slower than the SnAg solder and the IMC growth difference between both solder samples further increased as the aging time increased [16]. Furthermore, shear strength of as-reflow and aged composite Sn-Ag-Cu solder joints was improved with CNTs reinforcement [17].…”

Section: Introductionmentioning

confidence: 99%

Investigating the effect of isothermal aging on the morphology and shear strength of Sn-5Sb solder reinforced with carbon nanotubes

Dele‐Afolabi

Hanim

Mazlan

et al. 2015

Journal of Alloys and Compounds

View full text Add to dashboard Cite

“…One of the current efforts to improve the properties of joints involves adding other particles into the lead-free solders [ 9 ]. Many researchers have found that the wettability of lead-free solders and the mechanical properties of the soldering joint can be strengthened by adding metal or rare earth particles into the solder matrix [ 9 , 10 , 11 , 12 , 13 , 14 ]. However, the superior properties of these composite solders are primarily dependent on the degree of dispersion of the particles in the solders, but uniform dispersion of particles in the solders is difficult because of the aggregation and small solubility in the solders of the particles [ 14 ].…”

Section: Introductionmentioning

confidence: 99%

Interfacial Reaction and IMC Growth of an Ultrasonically Soldered Cu/SAC305/Cu Structure during Isothermal Aging

Long

et al. 2018

Materials

View full text Add to dashboard Cite

In order to accelerate the growth of interfacial intermetallic compound (IMC) layers in a soldering structure, Cu/SAC305/Cu was first ultrasonically spot soldered and then subjected to isothermal aging. Relatively short vibration times, i.e., 400 ms and 800 ms, were used for the ultrasonic soldering. The isothermal aging was conducted at 150 °C for 0, 120, 240, and 360 h. The evolution of microstructure, the IMC layer growth mechanism during aging, and the shear strength of the joints after aging were systemically investigated. Results showed the following. (i) Formation of intermetallic compounds was accelerated by ultrasonic cavitation and streaming effects, the thickness of the interfacial Cu6Sn5 layer increased with aging time, and a thin Cu3Sn layer was identified after aging for 360 h. (ii) The growth of the interfacial IMC layer of the ultrasonically soldered Cu/SAC305/Cu joints followed a linear function of the square root of the aging time, revealing a diffusion-controlled mechanism. (iii) The tensile shear strength of the joint decreased to a small extent with increasing aging time, owing to the combined effects of IMC grain coarsening and the increase of the interfacial IMC. (iv) Finally, although the fracture surfaces and failure locations of the joint soldered with 400 ms and 800 ms vibration times show similar characteristics, they are influenced by the aging time.

show abstract

Fabrication and interfacial reaction of carbon nanotube-embedded Sn–3.5Ag solder balls for ball grid arrays

Cited by 13 publications

References 31 publications

Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions

Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions

Investigating the effect of isothermal aging on the morphology and shear strength of Sn-5Sb solder reinforced with carbon nanotubes

Interfacial Reaction and IMC Growth of an Ultrasonically Soldered Cu/SAC305/Cu Structure during Isothermal Aging

Contact Info

Product

Resources

About