Fabrication and evaluation of polyamide 6 composites with electrospun polyimide nanofibers as skeletal framework

Chen, Yu; Han, Donghua; Ouyang, Wen; Chen, Shouhui; Hou, Haoqing; Zhao, Yong; Fong, Hao

doi:10.1016/j.compositesb.2011.11.071

Cited by 43 publications

(22 citation statements)

References 23 publications

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“…The remarkable reinforcement of the PVDF/PI composites could be due to the intrinsic superior mechanical strength of aligned co-PI nanofibers and the strong interfacial adhesion between co-PI nanofibers and PVDF matrix (Fig. 1) [15]. Toughness is a useful parameter to access the flexibility of the materials.…”

Section: Resultsmentioning

confidence: 99%

“…Previous work found that the electrospun PI nanofibers possessed excellent mechanical strength [13], superior thermal stability [14], and super high toughness [13], which made them excellent candidates as reinforcements [15,16] and the layer-by-layer hot pressing can improve the uniformity and reduce the porosity of polymer-based composites [17][18][19]. Therefore, in this work, we choose high performance electrospun copolyimide (co-PI) nanofibers as reinforcement and high dielectric performance PVDF as matrix to prepare nanofiber reinforced all-organic composites.…”

Section: Introductionmentioning

confidence: 99%

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Electrospun nanofiber reinforced all-organic PVDF/PI tough composites and their dielectric permittivity

et al. 2015

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Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Electrospun nanofiber reinforced all-organic PVDF/PI tough composites and their dielectric permittivity

et al. 2015

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“…Polyimide (PI) is an important class of high‐performance polymer with excellent mechanical properties and thermal stability. The preparation and application of various electrospun PI nanofibers have been investigated by Hou and coworkers . For example, Chen et al .…”

Section: Introductionmentioning

confidence: 99%

High‐performance polyimide nanofibers reinforced polyimide nanocomposite films fabricated by co‐electrospinning followed by hot‐pressing

Ding

Huang

et al. 2018

J of Applied Polymer Sci

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The objective of this study was to develop aligned electrospun polyimide (PI) nanofibers (with rigid macromolecular backbone) reinforced PI (with flexible macromolecular backbone) nanocomposite films. Owing to uniform dispersion of aligned PI nanofibers and excellent interfacial adhesion/interaction between filler and matrix, the resulting nanocomposite films exhibited superior mechanical and thermal properties. The nanocomposite films were fabricated by co-electrospinning of two polyamic acids (PAAs) including a rigid PAA of poly(p-phenylene biphenyltetracarboximide) (BPDA-PDA) and a flexible PAA of poly(1,4-bis (3 0 ,4 0 -dicarboxyphenoxy) phenyldiphenyl ether tetramine) (HQDA-ODA); upon thermal imidization, hybrid PAA nanofiber belts (with different weight ratios of BPDA-PDA/ HQDA-ODA) were converted into hybrid PI nanofiber belts. Subsequently, these nanofiber belts were hot-pressed to fabricate HQDA-ODA PI nanocomposite films reinforced with BPDA-PDA PI nanofibers; in specific, the nanocomposite film consisting of 80 wt % BP-PI nanofibers exhibited the highest tensile strength and modulus of 957 AE 18 MPa and 12.32 AE 0.32 GPa, respectively. The nanocomposite films also possessed excellent thermal/thermomechanical properties. Therefore, these fiber-reinforced PI nanocomposite films might be promising high-performance structural/engineering materials that would be particularly useful for high-temperature applications. Moreover, the strategy of co-electrospinning hybrid nanofiber belts followed by hot-pressing could provide an innovative approach for making highperformance polymer-matrix composites.

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“…Reported data were the average value of at least three individual measurements. corresponds to the C=O asymmetric stretching vibration, 1720 cm −1 corresponds to the C=O symmetric stretching vibration, 1370 cm −1 corresponds to the C-N-C stretching vibration, and 720 cm −1 corresponds to the C=O bending vibration [26][27][28]. Furthermore, the absence of the characteristic absorption bands of PAA at approximately 1660 cm -1 corresponds to the amic acid C=O symmetric stretching vibration and 1535 cm -1 corresponds to the amide C-N asymmetric stretching vibration indicates complete imidization in the resulting composites [29,30].…”

Section: Characterizationsmentioning

confidence: 99%

Preparation and Characterization of Pure Organic Dielectric Composites for Capacitors

Mao

Zhang

et al. 2018

MATEC Web Conf.

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Abstract. This work reports the excellent dielectric composites were prepared from polyimide (PI) and poly(vinylidene fluoride) (PVDF) via solution blending and thermal imidization or chemical imidization. The dielectric and thermal properties of the composites were studied. Results indicated that the dielectric properties of the composites synthesized by these two methods were enhanced through the introduction of PVDF, and the composites exhibited excellent thermal stability. Compared to the thermal imidization, the composites prepared by chemical imidization exhibited superior dielectric properties. This study demonstrated that the PI/PVDF composites were potential dielectric materials in the field of electronics.

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Fabrication and evaluation of polyamide 6 composites with electrospun polyimide nanofibers as skeletal framework

Cited by 43 publications

References 23 publications

Electrospun nanofiber reinforced all-organic PVDF/PI tough composites and their dielectric permittivity

Electrospun nanofiber reinforced all-organic PVDF/PI tough composites and their dielectric permittivity

High‐performance polyimide nanofibers reinforced polyimide nanocomposite films fabricated by co‐electrospinning followed by hot‐pressing

Preparation and Characterization of Pure Organic Dielectric Composites for Capacitors

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