2011
DOI: 10.1016/j.sna.2010.11.013
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Fabrication and electrical properties of polymer-derived ceramic (PDC) thin films for high-temperature heat flux sensors

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Cited by 43 publications
(19 citation statements)
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“…PDCs with thickness above 500 m typically exhibit cracks or warping [30,31]. To avoid this issue, a new PDC softlithography fabrication method is developed to realize PDC substrates up to 1500-m thick without the aforementioned problems.…”
Section: Fabrication Process Of Pdc Pressure Sensormentioning
confidence: 99%
“…PDCs with thickness above 500 m typically exhibit cracks or warping [30,31]. To avoid this issue, a new PDC softlithography fabrication method is developed to realize PDC substrates up to 1500-m thick without the aforementioned problems.…”
Section: Fabrication Process Of Pdc Pressure Sensormentioning
confidence: 99%
“…5 Besides that, different material formats and complex shapes can be made with the liquid processing ability of the polymer precursors, for example, thin films, hollow tubes, additively manufactured 3D objects, and bulk ceramics. 6,7 Among the PDCs, silicon oxycarbide (SiOC) has attracted considerable interest because of its enhanced thermomechanical properties, [8][9][10] high thermal stability, 11 and superior thermal conductivity. 12 In order to expand the scope of applications for SiOC ceramics, both inert and active fillers can be incorporated into polymer precursors before cross-linking to adjust their thermomechanical properties and functional properties.…”
Section: Introductionmentioning
confidence: 99%
“…40 and 135 for polycrystalline silicon and single crystal silicon, respectively . Additionally, PDCs show excellent chemical and mechanical properties (eg, high thermal stability, good oxidation/corrosion resistance, and good creep resistance under extreme environments), making PDCs promising materials for the development of harsh environment sensors …”
Section: Introductionmentioning
confidence: 99%