Fabrication and characterization of Y 2 O 3 dispersion strengthened copper alloys

Carro, G.; Muñóz, A.; Monge, M.A.; Savoini, B.; Pareja, R.; Ballesteros, C.; Adeva, P.

doi:10.1016/j.jnucmat.2014.08.050

Cited by 46 publications

(12 citation statements)

References 21 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Firstly, the oxide dispersed particles, like Y 2 O 3 , are very stable with temperature and do not decomposed or dissolved in the temperature operative window of the Cu based materials.. Secondly, the presence of a fine dispersion of particles retards the recrystallization phenomenon, increases the resistance to softening at high temperatures and does not imply an appreciable decrease in the thermal conductivity. Previous studies have reported that in ODS Cu-Y 2 O 3 , the dispersion of Y 2 O 3 nanoparticles gives place to an increase in the mechanical resistance of copper [6,7]. Furthermore, Neklyudov et al have reported that the presence of a small amount of yttrium dispersed in copper reduces the damage of defects due to neutron irradiation [8].…”

Section: Introductionmentioning

confidence: 99%

Thermal conductivity and diffusivity of Cu-Y alloys produced by different powder metallurgy routes

Carro

Muñóz

Monge

et al. 2017

Fusion Engineering and Design

Self Cite

View full text Add to dashboard Cite

Full density Cu-1%Y and Cu-0.8%Y alloys have been produced by different powder metallurgy routes and subsequent hot isostatic pressing. Some of the alloys have been subjected to equal channel angular pressing (ECAP) via B C route up to 8 passes. ECAP deformation homogenizes and refines the microstructure up to attaining a sub-micron grain structure. Thermal properties have been characterized by the laser flash method in the temperature range 373-773 K. The ECAP process, irrespective of the production route, enhanced the thermal conductivity to values similar to those for CuCrZr (ITER grade). The linear thermal expansion coefficient was temperature independent for all materials.

show abstract

Section: Introductionmentioning

confidence: 99%

Thermal conductivity and diffusivity of Cu-Y alloys produced by different powder metallurgy routes

Carro

Muñóz

Monge

et al. 2017

Fusion Engineering and Design

Self Cite

View full text Add to dashboard Cite

show abstract

“…Pure copper has a very high thermal conductivity but its strength is relatively low especially at high temperatures. Furthermore, the service life of pure copper is limited because of its high creep, swelling rate and irradiation hardening [ 6 , 7 ]. Therefore, it is necessary to develop copper alloys with both high strength and good thermal conductivity.…”

Section: Introductionmentioning

confidence: 99%

“…In addition, the high thermodynamic stability of Y 2 O 3 enhances the coarsening resistance at high temperatures [ 22 ]. Many efforts have been devoted to develop Y 2 O 3 dispersion-strengthened copper alloys by Mechanical Alloying (MA) methods [ 6 , 7 , 17 , 18 , 23 , 24 , 25 , 26 ]. For example, G. Carro et al [ 6 ] investigated the microstructural and mechanical properties of Cu-0.8wt.%Y produced by a powder metallurgy route and subsequent consolidation by hot isostatic pressing.…”

Section: Introductionmentioning

confidence: 99%

Development of Y2O3 Dispersion-Strengthened Copper Alloy by Sol-Gel Method

Xie

et al. 2022

Materials

View full text Add to dashboard Cite

In this study, oxide dispersion-strengthened Cu alloy with a Y2O3 content of 1 wt.% was fabricated through citric acid sol-gel synthesis and spark plasma sintering (SPS). The citric acid sol-gel method provides molecular mixing for the preparation of precursor powders, which produces nanoscale and uniformly distributed Y2O3 particles in an ultrafine-grained Cu matrix. The effects of nanoscale Y2O3 particles on the microstructure, mechanical properties and thermal conductivity of the Cu-1wt.%Y2O3 alloy were investigated. The average grain size of the Cu-1wt.%Y2O3 alloy is 0.42 μm, while the average particle size of Y2O3 is 16.4 nm. The unique microstructure provides excellent mechanical properties with a tensile strength of 572 MPa and a total elongation of 6.4%. After annealing at 800 °C for 1 h, the strength of the alloy does not decrease obviously, showing excellent thermal stability. The thermal conductivity of Cu-1wt.%Y2O3 alloy is about 308 Wm−1K−1 at room temperature and it decreases with increasing temperature. The refined grain size, high strength and excellent thermal stability of Cu-1wt.%Y2O3 alloys can be ascribed to the pinning effects of nanoscale Y2O3 particles dispersed in the Cu matrix. The Cu-Y2O3 alloys with high strength and high thermal conductivity have potential applications in high thermal load components of fusion reactors.

show abstract

“…Composites with unique properties can be prepared by various techniques; the bases include casting and powder metallurgy [6][7][8][9]. Carro et al [10] fabricated Cu-Y 2 O 3 dispersion strengthened composite by two different routes: casting and powder metallurgy (cryomilling and mechanical alloying). They found that the powder metallurgy route compared with the casting presents a significant dispersion of oxide nanoparticles inside the copper grains, the smallest grain size, *Corresponding author: tel.…”

Section: Introductionmentioning

confidence: 99%

Microstructure and fracture mechanism of Cu-Y2O3 composite

Velgosová¹,

Nagy²,

Besterci³

et al. 2020

View full text Add to dashboard Cite

This work aimed to examine the structure of Cu-Y2O3 composite, analyse the fracture mechanism, and propose the model of fracture. The in-situ tensile test in SEM was used for direct observation of the process of deformation and fracture. Microscopic analysis revealed that Cu matrix grains are spherical with a mean diameter of ∼ 500 nm. EDX and selected area electron diffraction confirmed the presence of Y2O3 particles. Particles can be divided, according to the size, into two categories: smaller A (up to 20 nm) and more significant B (20-100 nm). The in-situ tensile test in SEM showed that the first cracks were created on the particle-matrix interfaces and in the triple point. Subsequent coalescence was observed, and we assumed that the cracks propagate along the grain boundaries. The fracture surface has a transcrystalline ductile character. Based on the in-situ observations and analysis, we proposed the model of fracture mechanism.

show abstract

Fabrication and characterization of Y 2 O 3 dispersion strengthened copper alloys

Cited by 46 publications

References 21 publications

Thermal conductivity and diffusivity of Cu-Y alloys produced by different powder metallurgy routes

Thermal conductivity and diffusivity of Cu-Y alloys produced by different powder metallurgy routes

Development of Y2O3 Dispersion-Strengthened Copper Alloy by Sol-Gel Method

Microstructure and fracture mechanism of Cu-Y2O3 composite

Contact Info

Product

Resources

About